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We in Resonac propose various effective solutions for the problem-solving in manufacturing and technology development.

Thorough Explanation 【Thorough Explanation】Newest Trends of Next-Gen Semiconductor Packages, Materials, and Substrates This article describes the increasing density of semiconductor packages due to technologies like IoT, 5G, ADAS, and AI, and discusses the challenges and trends of development of next-gen 3D packages. Semiconductor/Electronic materials Power semiconductor xEV Thermal Management Heat dissipation properties Thermal insulation
Solution Effective solution to inverter cooling system problems!
The non-plated Al/Cu composite heatsink We propose Resonac’s inverter cooling device using non-plated aluminum to prevent coolant-related corrosion, with the Al/Cu composite heatsink and sintered copper paste to reduce thermal resistance. Automotive materials xEV Miniaturization Heat dissipation properties
Solution Enhancing the reliability of power semiconductors!
High Tg, Heat-Resistant Epoxy Molding Compounds Resonac’s heat-resistant epoxy molding compounds feature high Tg, restrain decomposition, prevent delamination, and relax stress, improving reliability test with optimally balanced materials. Semiconductor/Electronic materials Power semiconductor Heat resistance
Solution 77 GHz radar substrate material with excellent RF performance, processability, and reliability Resonac’s LW-990(RFD) features excellent RF performance, processability, and reliability with a low CTE and low elastic modulus resin, meeting 77 GHz radar substrate through precision miniaturization. Automotive materials Millimeter wave Sensor High integration Miniaturization Low dielectric/High frequency
Solution Thermal Insulation Coating for preventing energy loss in refrigerant pipes of EVs Resonac’s Thermal Insulation Coating provides excellent heat insulation, low thermal conductivity of 0.03 W/(m･K), and corrosion resistance, making it ideal for insulation of EVs’ refrigerant pipes. Automotive materials xEV Thermal Management Environmentally friendliness Productivity improvement Thermal insulation
Solution Positive photosensitive insulating resin for FOWLP RDL with high resolution and NMP-free Resonac’s <AR-5100> is a positive photosensitive material for FOWLP RDLs, using a phenol resin for high resolution. <AR-5100> is NMP-free and alkaline developable. Semiconductor/Electronic materials High integration Environmentally friendliness NMP-free
Solution HIMAL prevents delamination of a power semiconductor’s sealing material and improves reliability Used as a sealing material primer, "HIMAL" increases adhesion between the lead frame, semiconductor devices or wires and the sealing material, and reduces internal stress. The reliability of power semiconductors is improved by raising the sealing material’s heat resistance while preventing delamination. Semiconductor/Electronic materials Power semiconductor Stress relaxation Electrical insulation
Solution Achieving both low dielectric properties and high adhesion to copper foil!
Primer for millimeter wave circuit substrates Resonac’s primer achieves both low dielectric properties and high adhesion to low-roughness copper foil. Used as an adhesive between substrates and low-roughness copper foil, our SFR reduces transmission loss on the circuit substrates for communication terminals and base stations in 5G communication and other high frequency bands. Semiconductor/Electronic materials 5G Millimeter wave Low dielectric/High frequency
Thorough Explanation What is ACF (Anisotropic Conductive Film)?
Its usages, how to apply, types, and more are explained. This article explains what ACF stands for, its purposes, how to use, types, and the key points and basic knowledge in choosing the appropriate ACF; it also provides information about RESONAC’s ACF “ANISOLM,” a useful solution to delamination. Semiconductor/Electronic materials High integration Miniaturization
Solution High reliability die bonding paste for total cost reduction Die bonding material with low elasticity, excellent stress relaxation, and high adhesive strength. Reliable die bonding can be achieved without additional cost. Semiconductor/Electronic materials Stress relaxation
Solution High relative permittivity materials for transfer molding It is a high dielectric constant molding material with excellent workability. Due to its low dielectric loss tangent, it exhibits excellent transmission performance even in high frequency bands. Semiconductor/Electronic materials 5G Millimeter wave Miniaturization Low dielectric/High frequency
Solution High Thermal Conductive and Moisture Resistance AlN Filler New thermal conductive filler with high thermal conductivity, insulation reliability and moisture resistance. Semiconductor/Electronic materials Thermal Management Heat dissipation properties
Thorough Explanation 【Thorough Explanation】What are transmission loss, dielectric loss, and dielectric loss tangent? High-frequency transmission loss is a growing challenge due to increased data via IoT, 5G, ADAS, and AI. This article explains the causes and the reduction methods of transmission loss on PCBs. Semiconductor/Electronic materials 5G Low dielectric/High frequency
Solution A bonding film allowing to construct a PTFE multilayer Adhesive film with excellent adhesion to fluororesin. Low-temperature pressurization at 200°C enables multi-layering of fluororesin substrates. Semiconductor/Electronic materials Adhesion/Bonding Low dielectric/High frequency
Solution "SKYVEHEATSINK" realizing miniaturization and weight reduction By reducing fin thickness and pitch to levels difficult to achieve with extruded heatsinks, greater compactness and lighter weight can be achieved without undermining the heat dissipation performance. Semiconductor/Electronic materials 5G Thermal Management Miniaturization Weight reduction
Solution Die-bonding paste providing 180 W/(m・k) of thermal conductivity It is a sintered copper bonding paste that has a thermal conductivity of 180 W/(m・K) and can be die-bonded with no pressure or low thermocompression pressure. Semiconductor/Electronic materials Power semiconductor Heat dissipation properties
Solution Precision 3DP using UV curable monomers "FANCRYL" <500 series> has a bulky DCPD structure that it contributes to low cure shrinkage when added to 3D print resin formulations. Others Industrial use
Solution Laminate film cooler "LAMICOOLER" A new cooling device applied the packaging materials of pouch type Li-ion batteries SPALF as materials for the heat exchanger. Resonac can design compact and light-weighted heat exchanger. Automotive materials xEV Battery material Thermal Management Heat dissipation properties
Solution A heat-resistant binder resin that conforms to REACH regulations Binder resin that does not use REACH regulated substances. It has the same high heat resistance and mechanical properties as conventional PAI resin. Automotive materials Battery material Environmentally friendliness Heat resistance NMP-free
Solution Stress-absorption prepreg for reducing solder cracks
- Increases reliability of assembled electronic system! It is a sheet (prepreg) made by impregnating glass cloth with resin. It has a low modulus of elasticity and can absorb stress in solder joints and suppress cracks. Semiconductor/Electronic materials Stress relaxation
Solution Improve the productivity：
Mold cleaning sheets for semiconductor manufacturing processes Resonac's N-CS Series mold cleaning sheets, made of synthetic rubber, efficiently clean molds for semiconductor manufacturing, reducing cleaning time and increasing productivity by removing stains. Semiconductor/Electronic materials Cleaning
Solution Cleaning sheets for rubber molding that remove stains Resonac's QM Series mold cleaning sheets simplify the cleaning process of mold for rubber products, save time, and ensure quality by removing stains and residue without mold disassembly. Others Industrial use Cleaning
Solution Binder for lithium-ion batteries contributing to higher capacity A binder that uses polyamide-imide resin with excellent coating film strength. Contributes to improving the cycle characteristics of lithium-ion batteries. Automotive materials Battery material
Solution Aluminum/Plastic Composite Food Containers Almic-Can is a food container made from laminated aluminum foil and resin sheets. This container can thus contribute to solving the issue of food waste and reducing plastic consumption. Living Environmentally friendliness Designability
Solution Crosslinking agent for preventing degradation of rubber products A cross-linking agent that improves the heat resistance and tensile strength of butyl rubber. Productivity improvement in tire manufacturing can be expected. Automotive materials Productivity improvement Heat resistance
Solution Heat resistant coating binder "PNVA" <GE191 Series> Realizes high heat resistant and thin ceramic coating layer for LIB separators, improving safety and energy density of LIBs. Automotive materials Battery material Heat resistance
Solution A film capable of bonding a low heat-resistant circuit board It is possible to connect a circuit board with low heat resistance. Because the thickness is several tens of micrometers, it contributes to the thinning of connection parts. Semiconductor/Electronic materials Miniaturization

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