Applicable Business AreasManufacturers of electronic parts (sensors, connectors), etc.
Target ApplicationsStrengthening of grounding, terminal bonding
Although solder, which is generally used to bond a circuit board, has a high reliability, it has to be heated to its melting point (200ºC or more) for bonding. For this reason, it is necessary to select a high heat-resistant circuit board material. An isotropic conductive film we have developed allows for bonding of circuit boards under the temperature around 120ºC and at atmospheric pressure. Therefore, it is possible to bond a resin circuit board such as PET which is low heat-resistant and difficult to bond when solder is used.
While advanced electronic devices such as smartphones become thinner and lighter, they are equipped with various functions. Therefore, it is necessary to mount many electronic parts including sensors, and it is important to consider how to secure spaces for such parts. The thickness of our isotropic conductive film is several tens of micrometers, contributing to the thinning of connections.
Our isotropic conductive film allows for bonding using a vacuum laminator under a temperature of around 100ºC and a pressure of 0.1 MPa. Furthermore, this film has a high bonding reliability as it includes a thermosetting resin with excellent heat resistance and mechanical strength as well as conductive particles having a special shape.
A metal terminal having an oxide film such as aluminum can be bonded using a vacuum laminator and without flux. Moreover, no bonding material (film) comes out after bonding thanks to its excellent dimension stability, resulting in space saving between parts mounted on the circuit board.