Thermal Conductive Sheets for Semiconductor Packages

TC Series

About the product

Resonac’s thermal conductive sheets (TIM material) with electrical conductivity efficiently release heat from IC chips when applied a semiconductor package, and between IC chip and a heat spreader, heatsink or heat pipe.

Thermal Conductive Sheet -Series of TC

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Merits

  • Achieves high thermal conductivity in the thickness direction by vertically aligned graphite fillers.
  • Increases thermal conductivity by flexibly filling in gaps caused by differences in chip heights or uneven adhesive interface.
  • Possible to temporarily fix on heat modules with slight adhesiveness.
  • Applicable to next-generation large devices by flexibly fitting warped substrates.

Cross section of a thermal conductive sheet

Characteristics

Item TC Series Conventional products
TC-001 TC-HM03 TC-001D TC-S01A Silicone sheet Grease Indium
Features Standard Phase-change type High strength type Single-side reuse / repair [Laminated Al foil] Comparison Comparison Comparison
Thermal conductivity (W/mK) 40-90 40-90 40-90 40-90 2 1-10 80
Effective thermal conductivity (W/mK) 25-45 25-45 25-45 7-15 - - 70
Hardness Asker C 50-70 40-50 70-90 40-60 20-50 - >100
Adhesiveness (Nmm) 3.5-5.0 4.5-6.0 1.4-1.8 5.0-6.5 9-15 0 0
Thickness (mm) 【Our recommendation】 0.15-2.0 
【0.15-0.5】
0.15-2.0 
【0.15-0.5】
0.15-2.0 
【0.15-0.5】
0.2-2.0 
【0.2-0.5】
0.2-2.0 - 0.2
Tensile strength (MPa) 0.2 0.15 0.5 7 0.2 - -
Recommended assemble pressure (MPa) 0.3-1.0 0.15-0.6 1.0-3.0 0.3-1.0 - - -

Application example

(1)Desk top PC, Server

(2)Note book PC

(3)Power module

Expected field of application

  • The product’s superior thermal conductivity and cooling effect are expected to contribute to enhancing electronic device reliability and energy efficiency.

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