Thermal Conductive Sheet -Series of TC
Major Application
Thermal release for semiconductor device
About the product
Our thermal conductive sheet have high thermal conductivity in sheet direction orientation because of containing verticalyl oriented graphite fillers.
The sheets are flexible and slightly adhesive, allowing temporary attach on adherend.
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Features
- High thermal conductivity (Over 40 W/mK)
- Flexible and compressible (applicable even uneven surface)
- There is slight adhesiveness and allowing temporary attach on adherend.
Characteristics
Structure
Cross section of TC-001
Properties
| Item | TC-001 | TC-HM03 | TC-001D | TC-S01A | Silicone Sheet |
Grease | Indium |
|---|---|---|---|---|---|---|---|
| Feature | Standard | Phase-change-type | High Strength | Single Side Reuse [laminated Al foil] |
Comparison | Comparison | Comparison |
| Thermal conductivity (W/mK) |
40-90 | 40-90 | 40-90 | 40-90 | 2 | 1-10 | 80 |
| Effective thermal Conductivity (W/mK) |
25-45 | 25-45 | 25-45 | 7-15 | - | - | 70 |
| Hardness Asker C | 50-70 | 40-50 | 70-90 | 40-60 | 20-50 | - | >100 |
| Tackiness (Nmm) |
3.5-5.0 | 4.5-6.0 | 1.4-1.8 | 5.0-6.5 | 9-15 | 0 | 0 |
| Thickness (mm) [our recommendation] |
0.15-2.0 [0.15-0.5] |
0.15-2.0 [0.15-0.5] |
0.15-2.0 [0.15-0.5] |
0.2-2.0 [0.2-0.5] |
0.2-2.0 | - | 0.2 |
| Tensile strength (MPa) |
0.2 | 0.15 | 0.5 | 7 | 0.2 | - | - |
| Recommend assemble pressure (MPa) |
0.3-1.0 | 0.15-0.6 | 1.0-3.0 | 0.3-1.0 | - | - | - |
Application example
(1)Desk top PC, Server
(2)Note book PC
(3)Power module
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