Liquid Encapsulant CEL-C Series
Major Application
flip chip package underfill
About the product
We develop various types of liquid encapsulants along with cutting-edge packaging trend, COF, FCBGA, wafer level CSP and so on.
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Features
- Excellent moisture resistance & electrical properties.
- Excellent adhesion to the various types of substrates.
- Low ionic impurities.
- Minimum warpage by low CTE.
Features and Characteristics (Typical Values)
| Applications | Products | Features | Curing Conditions (°C/h) |
|
|---|---|---|---|---|
| COF (Underfill) |
 |
CEL-C-3900 Series |
It is a non-filler type material, excellent impregnation and migration resistance. | 120ºC/15min+ 150ºC/1h |
| FC-BGA (Underfill) |
 |
CEL-C-3730 Series |
It shows excellent adhesion in humidity and excellent reflow resistance and thermal cycling resistance by making the CTE meet that of solder bmp. | 150ºC/2h or 165ºC/2h |
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