Epoxy Molding Compounds <CEL> for Substrate
Major Application
semiconductor package transfer molding
About the product
This type is suitable for BGA and CSP, and has low warpage and excellent reflow crack resistance. It is also applicable for packages with narrow pad pitch and long wire.
Inquiry of this product
Features
- Small warpage after molding.
- Excellent reflow crack resistance.
- Applicability to mold underfilling process.
<Applications>
CSP, BGA, Stacked MCP and etc.
Characteristics (Typical Values)
| Item | Unit | CEL- 9750 ZHF10 HT3W |
CEL- 9750 ZHF10 |
CEL- 9750 HF10 |
CEL- 9700 HF10 |
CEL- 1702 HF13 |
CEL- 1802 HF19 |
GE- 100 |
GE- 110 |
|
|---|---|---|---|---|---|---|---|---|---|---|
| Applications | - | BGA,CSP | BOC | BOC | BGA,CSP | |||||
| Flame retardant type | - | No flame retardant |
No flame retardant |
No flame retardant |
No flame retardant |
Metal hydrox-ide |
Organic phos-phorous |
Metal hydrox-ide |
Metal hydrox-ide |
|
| Spiral flow | cm | 185 | 150 | 145 | 110 | 90 | 90 | 190 | 165 | |
| Tg | ºC | 145 | 150 | 140 | 125 | 125 | 120 | 145 | 155 | |
| CTE | α1 | ppm/ ºC |
12 | 7 | 7 | 6 | 12 | 9 | 9 | 9 |
| α2 | ppm/ ºC |
41 | 27 | 29 | 27 | 45 | 36 | 38 | 35 | |
| Flexural modulus | GPa | 27 | 26 | 27 | 27 | 16 | 17 | 23 | 22 | |
| Mold shrinkage | % | 0.18 | 0.08 | 0.1 | 0.1 | 0.32 | 0.35 | 0.1 | 0.08 | |
| Thermal conductivity | W/mK | 3 | - | - | - | - | - | - | - | |
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