Epoxy Molding Compounds <CEL> for Substrate

Major Application

semiconductor package transfer molding

About the product

This type is suitable for BGA and CSP, and has low warpage and excellent reflow crack resistance. It is also applicable for packages with narrow pad pitch and long wire.

Image of for Substrate

Features

  • Small warpage after molding.
  • Excellent reflow crack resistance.
  • Applicability to mold underfilling process.

<Applications>

CSP, BGA, Stacked MCP and etc.

Characteristics (Typical Values)

Item Unit CEL-
9750
ZHF10
HT3W
CEL-
9750
ZHF10
CEL-
9750
HF10
CEL-
9700
HF10
CEL-
1702
HF13
CEL-
1802
HF19
GE-
100
GE-
110
Applications - BGA,CSP BOC BOC BGA,CSP
Flame retardant type - No flame
retardant
No flame
retardant
No flame
retardant
No flame
retardant
Metal
hydrox-ide
Organic
phos-phorous
Metal
hydrox-ide
Metal
hydrox-ide
Spiral flow cm 185 150 145 110 90 90 190 165
Tg ºC 145 150 140 125 125 120 145 155
CTE α1 ppm/
ºC
12 7 7 6 12 9 9 9
α2 ppm/
ºC
41 27 29 27 45 36 38 35
Flexural modulus GPa 27 26 27 27 16 17 23 22
Mold shrinkage % 0.18 0.08 0.1 0.1 0.32 0.35 0.1 0.08
Thermal conductivity W/mK 3 - - - - - - -

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