Epoxy Molding Compounds <CEL> for Substrate
semiconductor package transfer molding
About the product
This type is suitable for BGA and CSP, and has low warpage and excellent reflow crack resistance. It is also applicable for packages with narrow pad pitch and long wire.
- Small warpage after molding.
- Excellent reflow crack resistance.
- Applicability to mold underfilling process.
CSP, BGA, Stacked MCP and etc.