Epoxy Molding Compounds <CEL> for Lead Frame
semiconductor package transfer molding
About the product
We have a top-level market share in epoxy molding compounds. Our products meet the customers' demands and the changes of package trends.
- Excellent moisture resistance and heat shock resistance.
- Excellent reflow crack resistance.
DIP, SOP, TSOP, QFP, TQFP, LQFP and etc.