Epoxy Molding Compounds <CEL> for Lead Frame
Major Application
semiconductor package transfer molding
About the product
We have a top-level market share in epoxy molding compounds. Our products meet the customers' demands and the changes of package trends.
Features
- Excellent moisture resistance and heat shock resistance.
- Excellent reflow crack resistance.
<Applications>
DIP, SOP, TSOP, QFP, TQFP, LQFP and etc.
Characteristics (Typical Values)
| Item | Unit | CEL-9240 ZHF10HT3W |
CEL-9240 HF10 |
CEL-8240 HF10 |
CEL-9200 HF10 |
CEL-9200 HF9 |
|
|---|---|---|---|---|---|---|---|
| Applications | - | QFP,SOP,QFN,PLCC | QFP,SOP,TSOP | QFP,SOP,QFN,PLCC | QFN | ||
| Flame retardant type | - | No flame retardant |
No flame retardant |
No flame retardant |
No flame retardant |
Organic phosphorous |
|
| Spiral flow | cm | 140 | 100 | 120 | 100 | 110 | |
| Tg | ºC | 125 | 110 | 110 | 125 | 110 | |
| CTE | α1 | ppm/ºC | 12 | 7 | 8 | 8 | 8 |
| α2 | ppm/ºC | 38 | 28 | 35 | 33 | 32 | |
| Flexural modulus | GPa | 30 | 33 | 25 | 27 | 27 | |
| Mold shrinkage | % | 0.15 | 0.16 | 0.17 | 0.17 | 0.22 | |
| Thermal conductivity | W/mK | 3 | - | - | - | - | |
