Epoxy Molding Compounds <CEL> for Lead Frame

Major Application

semiconductor package transfer molding

About the product

We have a top-level market share in epoxy molding compounds. Our products meet the customers' demands and the changes of package trends.

Image of for Lead Frame

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Features

  • Excellent moisture resistance and heat shock resistance.
  • Excellent reflow crack resistance.

<Applications>

DIP, SOP, TSOP, QFP, TQFP, LQFP and etc.

Characteristics (Typical Values)

Item Unit CEL-9240
ZHF10HT3W
CEL-9240
HF10
CEL-8240
HF10
CEL-9200
HF10
CEL-9200
HF9
Applications - QFP,SOP,QFN,PLCC QFP,SOP,TSOP QFP,SOP,QFN,PLCC QFN
Flame retardant type - No flame
retardant
No flame
retardant
No flame
retardant
No flame
retardant
Organic
phosphorous
Spiral flow cm 140 100 120 100 110
Tg ºC 125 110 110 125 110
CTE α1 ppm/ºC 12 7 8 8 8
α2 ppm/ºC 38 28 35 33 32
Flexural modulus GPa 30 33 25 27 27
Mold shrinkage % 0.15 0.16 0.17 0.17 0.22
Thermal conductivity W/mK 3 - - - -

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