Dicing Die Bonding Film FH Series
Die Bonding Film
About the product
FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at one time, it has achieved easy handling of thinner wafers.
FH series is a co-developed product with The Furukawa Electric Co., Ltd.
- Excellent dicing and pick-up performance.
- Low lamination temperature to a wafer.
- Excellent wire bondability without film curing.
- Excellent reflow crack resistance.