Dicing Die Bonding Film FH Series

Die Bonding Film

About the product

FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at one time, it has achieved easy handling of thinner wafers.
FH series is a co-developed product with The Furukawa Electric Co., Ltd.


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  • Excellent dicing and pick-up performance.
  • Low lamination temperature to a wafer.
  • Excellent wire bondability without film curing.
  • Excellent reflow crack resistance.

Characteristics (Typical Values)

Item Unit FH-9011 Test method
Adhesive Thickness μm 10, 20, 25, 40
DC tape
Exposure doze mJ/cm2 150~400
Adhesive strength between
Before UV N/25mm 1.4
After UV N/25mm <0.1
Wafer laminating temp. ºC 60~80
Die bonding condition Temp. ºC 100~160
Load MPa 0.05~2.0
Elastic modulus (35ºC) MPa 200 DMA
Tg ºC 180 TMA
Die shear strength (260ºC) N/chip >100 5x5mm chip

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