for Substrate
Die Bonding Paste <EPINAL>
About the product
"EPINAL" has an excellent adhesion to various materials. The adhesiveness is controllable for different chip sizes and die bonding condition. It is available for Pb-free reflow.

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Features
- Excellent workability to eliminate any problems of bonding layer.
- Fast curability for high productivity.
- Low stress for low warpage and high reliability.
Characteristics (Typical Values)
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