Die Bonding Paste ＜EPINAL＞
About the product
"EPINAL" has an excellent adhesion to various materials. The adhesiveness is controllable for different chip sizes and die bonding condition. It is available for Pb-free reflow.
- Excellent workability to eliminate any problems of bonding layer.
- Fast curability for high productivity.
- Low stress for low warpage and high reliability.
Characteristics (Typical Values)