Die Bonding Paste
EPINAL Series
About the product
Resonac’s solvent-free die bonding paste (conductive and non-conductive types) bonds chips to leadframes and organic substrates when manufacturing semiconductor packages.
Resonac offers a wide-ranging lineup with its die bonding paste holding a large global market share.
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Merits
- Low elastic modulus and high adhesive strength realizes greater reliability even for MSL1
- Suitable for package on leadframes and organic substrates
- Low-cost type using both aluminum and silver filler is also available
- High thermal conductivity (17W/m-K) type effective for power devices and modules is lined up
Characteristics
| Item | Unit | EN-4900GC | EN-4900F | EN-4900LR | EN-4950 | EN-4900SLA-2 | EN-4900LC-18 | EN-4900GCN3 | Testing conditions, etc. | |
|---|---|---|---|---|---|---|---|---|---|---|
| Features | – | Standard high reliability, supporting many L/Fs and PKGs | Low elasticity, low stress, applicable to large chips | For gold-plated chips, PPF, excellent electrical properties | High thermal conductivity, excellent electrical properties | Low silver content | Combining silver and aluminum fillers | Applicable to insulative types, BGA, etc. | – | |
| Resin type | – | Acrylic & epoxy | Acrylic | Acrylic | Acrylic | Acrylic & epoxy | Acrylic & epoxy | Acrylic & epoxy | – | |
| Viscosity | 0.5rpm | Pa∙s | 60 | 84 | 73 | 94 | 60 | 51 | 110 | Type E viscometer 3°cone rotor, 25℃ |
| 5.0rpm | Pa∙s | 12 | 19 | 13 | 24 | 12 | 15.5 | 26.4 | ||
| Die shear strength | 250ºC | MPa | 4.8 | 5 | 6.1 | 5.2(*1) | 5.2(*1) | 5.7(*1) | 3.4(200℃) (*2) |
2x2 mm chip silver SPOT plated lead frame (*1: copper frame) 180℃/1 h curing (oven) (*2: 150℃/1 h curing (oven)) |
| Viscoelasticity (DMA) | MPa |
3,640 |
1,030 | 8,830 | 5,810 | 2,360 | 4,750 | 1,420 | DMA, 180℃/1 h curing |
|
| Thermal conductivity | W / m∙K | 2 | 3 | 4 | 17 | 1 | 2 | <1 | Laser flash method | |
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