for Lead Frame
Die Bonding Paste ＜EPINAL＞
About the product
"EPINAL" has been used as a die bonding adhesive for semiconductor devices. We have a top-level market share in die bonding paste.
- Excellent workability to eliminate any problems of bonding layer.
- Fast curability for high productivity.
- Low stress for low warpage and high reliability.
- High thermal conductivity.
Characteristics (Typical Values)
- ※ 2x2 Si chip