Photosensitive Insulation Materials for Redistribution Layers
AH/AR Series
About the product
Resonac’s photosensitive resin materials are designed to form the insulation parts of redistribution layers (RDL) in semiconductor packages.
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Merits
- Positive photosensitive insulation materials responding to TMAH development.
- Superior resolution that enables the formation of finer, excellent shaped vias and L/S patterns (via = 2 µm).
- Responds to forming multilayer wiring with superior film thickness uniformity, low warpage, and low-temperature curing.
- Environmentally friendly and safe with no NMP.
Characteristics
- ※ 10 µm film thickness after cure
Cross Section of the AH Series after Curing
Application Example of the AH Series for Redistribution Insulation Layers on WL-CSP
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