for IC chip
ACF(Anisotropic Conductive Films)<ANISOLM>
About the product
This type is available for microscopic bump of bare chip. It has excellent adhesion to glass and IC chip.

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Applications
Interconnection between LCD and driver IC

Features
- Microscopic bump applicable
- High adhesion and high reliability
- Low contact resistance
- Short bonding time
- For low stress
Characteristics
- ※ Based on electrode area
Inquiry of this product