for IC chip
ACF(Anisotropic Conductive Films)<ANISOLM>
About the product
This type is available for microscopic bump of bare chip. It has excellent adhesion to glass and IC chip.

Applications
Interconnection between LCD and driver IC

Features
- Microscopic bump applicable
- High adhesion and high reliability
- Low contact resistance
- Short bonding time
- For low stress
Characteristics
- ※ Based on electrode area