MCL-LW-900G/910G
Halogen Free, High Tg, Low Transmission Loss Multilayer Material
About the product
- Product
- CCL
-
MCL-LW-900G/910G
- Prepreg
-
GWA-900G/910G
- Applications
- High-speed computer, server
- High-speed router
- High frequency devices, antenna
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Features
- MCL-LW-910G achieved low dielectric constant (3.3 at 10 GHz) and low dissipation factor (0.0028 at 10 GHz) using low Dk glass and HVLP copper.
- Enables high-speed transmission/communication at 25 Gbps by low transmission loss properties.
- Has excellent heat resistance and connection reliability.
Characteristics
Dielectric characterization results
- Measurement Conditions
-
- Method: Triplate-Line Resonator (JPCA-TM001)
- Temperature & Humidity: 25℃/60%RH
- Laminate Thickness (b): 1.6 mm (Signal-Ground: 800 µm), Trace thickness(t): 18 µm (RT, HVLP)
- Signal Conductor Line Width(w): 1 mm (Zo: ca.50 Ω)
Transmission Loss
- Measurement conditions
-
- Evaluation PWB: Strip-line
- Temperature & Humidity: 25℃/60%RH
- Characteristic impedance: Approx. 50 Ω
- Inner layer surface treatment: Black-reduction
- Proofreading method: TRL (Thru-Reflect-Line)
- Trace width(w): 0.120 mm
- Dielectric thickness(b): 0.25 mm
- Trace thickness(t): 18 µm
Copper Clad Laminate
- ※1 Heating Rate: 10℃/min.(Comp.)
- ※2 Measured by Cavity Resonator.
- ※3 Refer to"Condition Note"
- ※ Above data are experimental results and not guaranteed.
Standard Specifications
Copper Clad Laminate
Note1) Laminate thicknessmeans dielectric layer thickness.
Prepreg
- ※1 The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%. Values change depending on the press condition or inner layer pattern.
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