TD-002
Reduction of Solder Crack/Low Elastic Modulus Material
About the product
- Product
- Prepreg
-
TD-002
- Applications
- Electronic equipment for automobiles
- Engine room set board
- PCB on component packagings
Inquiry of this product
Features
- Applied to PWB surface of standard material to absorb soldering stress and inhibit solder crack.
- Elastic modulus is 1/4 of that of standard FR-4.
- Enables to reduce solder crack without using high functional material by combining TD-002 with standard material.
Characteristics
Connection reliability of Pb-free solder [Thermal condition: -40℃ (30 min.)⇔125℃ (30 min.)] ![Connection reliability of Pb-free solder [Thermal condition: -40℃ (30min.)⇔125℃ (30min.)]](/sites/default/files/2022-11/bm015002e.png)
- Solder crack of TD-002+FR-4 (Cross section, after 3000cycles.)
2125R
3226R
Elastic modulus 
Mechanical drilling processing [After 3000 hits]
TD-002+FR-4
Appearance after drilling
![Mechanical drilling processing [After 3000 hits]](/sites/default/files/2022-11/bm015007e.jpg)
- Conditions of mechanical drilling
-
- Stack-up: 3 panels
- Revolution: 120 krpm
- Drill bit: φ 0.3 mm
- E/B: Al t0.15 mm
- Feeding speed: 2.4 m/min.
Prepreg
(3313N58, t0.4mm, t0.1mm)
| Item | Condition ※4 | Unit | Actual Value | Reference (IPC-TM-650) |
||
|---|---|---|---|---|---|---|
| TD-002 | ||||||
| Tg | TMA method | A | ℃ | 155–170 | 2.4.24 | |
| CTE ※1 | X ※2(30–120℃) | A | ppm/℃ | 6–9 | ‐ | |
| Y※2(30–120℃) | 6–9 | |||||
| Z | (＜Tg) | A | 80–130 | 2.4.24 | ||
| (＞Tg) | A | 200–300 | ||||
| Solder Heat Resistance (260℃) | A | sec. | ≧300 | ‐ | ||
| T-260 (Without Copper) | A | min. | ≧50 | 2.4.24.1 | ||
| T-288 (Without Copper) | ≧5 | |||||
| Decomposition Temperature (TGA method 5％ Weight Loss) | A | ℃ | 345–360 | 2.3.40 | ||
| Copper Peel Strength | 18 µm | A | kN/m | 0.8–0.9 | 2.4.8 | |
| 35 µm | 0.9–1.1 | |||||
| Flexural Modulus (Lengthwise) | A | GPa | 5–8 | 2.4.4 | ||
| Elastic Modulus (Lengthwise) Tensile | A | GPa | 7–10 | ‐ | ||
| Dielectric Constant | 1 GHz ※3 | A | － | 3.6–3.8 | IEC-62810 | |
| Dissipation Factor | 1 GHz ※3 | A | － | 0.011–0.013 | ||
| Volume Resistivity | C-96/40/90 | Ω･cm | 1×1014–1×1016 | 2.5.17 | ||
| Surface Resistance | C-96/40/90 | Ω | 1×1013–1×1015 | |||
| Insulation Resistance | A | Ω | 1×1014–1×1016 | ‐ | ||
| D-2/100 | 1×1012–1×1014 | |||||
- ※1 Heating Rate: 10℃/min.
- ※2 Tensile.
- ※3Measured by cavity resonator.
- ※4Refer to"Condition Note"
- ※ Above data are experimental results and not guaranteed.
Standard Specification
Prepreg
| Part Number | Type | Glass Cloth | Properties | ||
|---|---|---|---|---|---|
| Style | Resin Content (%) |
Dielectric Thickness after Lamination ※1 |
|||
| TD-002 | 0.06 | (1037N77) | 1037 | 77±2 | 0.069 mm |
| 0.08 | (1078N66) | 1078 | 66±2 | 0.088 mm | |
| 0.10 | (3313N58) | 3313 | 58±2 | 0.115 mm | |
| 0.20 | (1501N54) | 1501 | 54±2 | 0.208 mm | |
| Reference (IPC-TM-650) | 2.3.16 | ‐ | |||
※1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%. Value changes depending on the press condition or inner layer pattern.
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