MCL-E-795G

Halogen Free, High Tg, High Elastic Modulus and Low CTE Material

About the product

  • Product
    CCL

    MCL-E-795G

    Prepreg

    GEA-795G

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Applications

  • Semiconductor packages (FC-BGA)
  • Center core of buildup construction

Benefits

  • MCL-E-795G has low CTE value in X, Y directions and can reduce warpage of package significantly.
  • MCL-E-795G (Type LH) has low CTE value.
  • Well-suited for center core of buildup construction.

Characteristics

Warpage Performance [3-2-3 construction]

TEG Substrate

  • Package size: 40 mm×40 mm
  • Core thickness: 0.4 mm / 0.8 mm
  • BU thickness: 20 µm
  • SR thickness: 19 µm

TEG Chip

  • Die size: 20 mm×20 mm
  • Die height: 775 µm

Copper Clad Laminate

(t0.4 mm)

Item Condition ※4 Unit Actual value Reference
MCL-E- 795G MCL-E- 795G
(Type X)		 MCL-E- 795G
(Type LH)		 (IPC-TM-650)
Tg TMA method A °C 260 - 290 2.4.24
DMA method A 315 - 345 ‐
CTE ※1 X (30 - 120 °C) A ppm/°C 3.0 - 5.0 2.0 - 4.0 0.5 - 3.0 ‐
Y (30 - 120 °C) A 3.0 - 5.0 2.0 - 4.0 0.5 - 3.0
Z ※2 (<Tg) A 10 - 15 2.4.24
(>Tg) 70 - 100
Solder Heat Resistance (260 °C) A sec ≥300 ‐
T-260 (Without Copper) A min ≥60 2.4.24.1
T-288 (Without Copper) A ≥60
Decomposition Temperature (TGA, 5 % weight loss) A °C 470 - 490 2.3.40
Copper Peel strength 12 µm A kN/m 0.8 - 1.0 2.4.8
18 µm A 0.9 - 1.1
Flexural Modulus (Lengthwise) ※2 A GPa 35 - 37 36 - 38 40 - 42 ‐
 Dielectric Constant 1 GHz ※3 A － 4.3 - 4.5 4.2 - 4.4 4.1 - 4.3 ‐
Dissipation Factor 1 GHz ※3 A － 0.005 - 0.007 0.005 - 0.007 0.005 - 0.007 ‐
Volume Resistivity C-96/40/90 Ω⋅cm 1×1014 - 1×1016 2.5.17
Surface Resistance C-96/40/90 Ω 1×1013 - 1×1015 2.5.17
Insulation Resistance A Ω 1×1014 - 1×1016 ‐
D-2/100 1×1012 - 1×1015 ‐
  • ※1 Heating Rate: 10 °C/min(Comp.)
  • ※2 800 μm thickness.
  • ※3 Measured by SPDR.
  • ※4 Refer to "Condition Note"PDFを開く
  • ※ Above data are experimental results and not guaranteed.
  •  

Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Thickness Code Laminete Thickness
MCL-E-795G － 12 µm
18 µm
（STD）
2 µm
3 µm
12 µm
（LP, PF）		 M0.06 0.06 mm
0.1 0.11 mm
0.2 0.21 mm
0.41 0.41 mm
0.61 0.61 mm
0.81 0.82 mm
1.01 1.02 mm
1.21 1.23 mm
1.41 1.43 mm
1.61 1.64 mm
（X） 12 µm
18 µm
（STD）
2 µm
3 µm
12 µm
（LP, PF）		 0.41 0.41 mm
0.61 0.62 mm
0.71 0.22 mm
0.81 0.82 mm
1.01 1.02 mm
1.21 1.23 mm
1.41 1.43 mm
1.61 1.64 mm
（LH） 12 µm
18 µm
（STD）
2 µm
3 µm
12 µm
（LP, PF）		 0.1 0.11 mm
D0.15 0.16 mm
0.2 0.22 mm
0.41 0.43 mm
0.61 0.64 mm
0.71 0.75 mm
0.81 0.85 mm
1.01 1.07 mm
1.21 1.28 mm
1.41 1.49 mm
1.61 1.71 mm
  • Note1)STD: Standard copper foil, LP: Low Profile copper foil, PF: Profile-free copper foil.
  • Note2) Laminate thickness means that of dielectric layer thickness.

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)		 Dielectric Thickness
after Lamination ※1 
GEA-795G ‐ 0.03 （1027N76） 1027 76±2 0.044 mm
0.04 （1037N76） 1037 76±2 0.053 mm
0.06 （1078N66） 1078 66±2 0.072 mm
0.1 （2116N58） 2116 58±2 0.124 mm
（L） 0.03 （1027N73） 1027 73±2 0.039 mm
0.03 （1027N76） 1027 76±2 0.044 mm
0.04 （1037N76） 1037 76±2 0.053 mm
0.06 （1078N66） 1078 66±2 0.072 mm
0.06 （1280N63） 1280 63±2 0.072 mm
0.08 （2013N58） 2013 58±2 0.096 mm
0.1 （2116N58） 2116 58±2 0.125 mm
  • ※1 The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is within 0%.

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