MCL-E-770G (Type R)

Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material

About the product

  • Product
    CCL

    MCL-E-770G (Type R)

    Prepreg

    GEA-770G

  • Applications
    • Semiconductor packages. (FC-CSP, PoP, SiP)
    • Thinner module.

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Features

  • MCL-E-770G has low CTE values in X, Y directions and reduces warpage of package substrate significantly.
  • MCL-E-770G (Type RLH) has lower CTE value (less than 2.0 ppm/℃).

Copper Clad Laminate

Warpage of FC-CSP

TEG Chip
  • Chip size: 7.3 mm×7.3 mm
  • Chip thickness: 150 µm
  • Underfill thickness: 60 µm (CEL-C-3730-4)
  • Solder Resist thickness: 20 µm (FZ-2700GA)
TEG Substrate
  • Package size: 14 mm×14 mm
  • Core Thickness 200 µm+1024 (S-HD) PPG
Warpage of FC-CSP
Warpage of FC-CSP

Copper Clad Laminate

(t0.2mm)

Item Condition ※3 Unit Actual Value Reference
(IPC-TM-650)
MCL-E-
770G (Type R)		 MCL-E-
770G (Type RLH)
Tg TMA method A ℃ 260–280 2.4.24
DMA method A 300–330 ‐
CTE ※1 X (30–100℃) A ppm/℃ 4.0–6.0 1.5–2.0 ‐
Y (30–100℃) 4.0–6.0 1.5–2.0
Solder Heat Resistance (260℃) A sec. ＞300 ‐
T260 (Without copper) A min. ＞60 2.4.24.1
T288 (Without copper) ＞60
Decomposition Temperature (TGA method 5% Weight Loss) A ℃ 430–450 2.3.40
Heat Resistance for HDI Process (Semi-Additive) 260℃ Reflow cycles ＞20 ‐
Copper Peel Strength 12 µm A kN/m 0.7–0.9 2.4.8
18 µm 0.8–1.0
Surface Roughness (Ra) A µm 2–3 2.2.17
Flexural Modulus (Lengthwise) ※4 A GPa 30–32 34–36 ‐
Dielectric Constant 10GHz ※2 A ‐ 4.2–4.4 3.9–4.1 -
Dissipation Factor 10GHz ※2 A － 0.006–0.008 0.006–0.008 ‐
Volume Resistivity C-96/40/90 Ω･cm 1×1014–1×1016 2.5.17
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016 ‐
D-2/100 1×1012–1×1014 ‐
  • ※1 Heating Rate: 10℃/min.
  • ※2 Measured by SPDR.
  • ※3 Refer to "Condition Note"PDFを開く
  • ※4 t0.8mm
  • ※t0.4mm thickness core is used depending on test item.
  • ※ Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Code Name Laminate Thickness
MCL-E-770G (R) 2 µm
3 µm
12 µm
(LP, PF)		 T0.05 0.05mm
U0.04 0.04mm
2 µm
3 µm
12 µm
(STD, LP, PF)		 M0.06 0.06mm
M0.11 0.10mm
0.2 0.20mm
(RLH) 2 µm
3 µm
12 µm
18 µm
(STD, LP, PF)		 U0.04 0.04mm
M0.06 0.07mm
0.2 0.21mm
  • ※1 STD: Standard copper foil, LP: Low profile copper foil, PF: Profile free copper foil.
  • ※2 STD: 12 µm, 18 µm; LP: 2 µm, 3 µm, 12 µm, 18 µm.
  • ※3 In case laminate thickness lies in between two thickness figures shown above, tolerance of such laminate would be equal to the tolerance of thicker one.
  • ※4 Laminate thickness means dielectric layer thickness

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)		 Dielectric Thickness
after Lamination ※1 (mm)
GEA-770G - ≦0.025 (See [GEA-770G --- ] page for ultra thin, flat prepregs)
‐ 0.025 (1017N72) 1017 72±2 0.025
0.025 (1017N76) 1017 76±2 0.030
0.03 (1027N72) 1027 72±2 0.040
0.03 (1027N76) 1027 76±2 0.048
0.04 (1037N72) 1037 72±2 0.048
(L) 0.025 (L1017N72) 1017 72±2 0.025
0.025 (L1017N76) 1017 76±2 0.030
0.03 (L1027N72) 1027 72±2 0.040
0.03 (L1027N76) 1027 76±2 0.048
0.035 (L1024N68) 1024 68±2 0.041
0.035 (L1024N73) 1024 73±2 0.050
0.04 (L1037N72) 1037 72±2 0.048
0.045 (L1030N71) 1030 71±2 0.058
Reference (IPC-TM-650) 2.3.16 ‐
  • ※1 Dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%. Value changes depending on the press condition or inner layer pattern.

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