GEA-705G, GEA-770G, GEA-795G

Thin Prepreg with Superior Surface Smoothness

About the product

  • Product
    Prepreg

    GEA-705G, GEA-770G, GEA-795G

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Applications

  • Semiconductor packages. (FC-BGA, FC-CSP, PoP, SiP)
  • HDI, PWB
  • Thinner module, PWB

Benefits

  • Superior in impedance control as prepreg thickness variation is small after press.
  • Suitable for fine line formation with its smooth surface.
  • Can achieve insulation layer thickness 16 µm.
  • Suitable for coreless structure by superior variation of dimensional change.
  • Undulation of TYPE-F prepreg is small after press. TYPE-F technology can reduce warpage at assembly.

Characteristics

Surface Smoothness of Prepreg (Microscope)

Surface Smoothness of Prepreg (Microscope)

TYPE-F

Surface Smoothness of Prepreg (Microscope)

Conventional

Panel Warpage of Prepreg After Press (w/o Copper, by Shadow Moire)

Panel Warpage of Prepreg after press (w/o copper, by shadow moire)

TYPE-F

Panel Warpage of Prepreg after press (w/o copper, by shadow moire)

Conventional

Prepreg Thickness After Press

Laminate condition

Sample

  • GEA-705G 1010F78
  • Copper foil: 3 µm
  • Temp.: 230 °C, 100 min
  • Heating rate: 3.0 °C/min
  • Pressure: 3 MPa

 

Measurement method
Prepreg thickness after Press
Prepreg thickness after Press

Undulation of Prepreg After Press (GEA-705G1010F78)

Undulation of prepreg after press (GEA-705G1010F78)

TYPE-F

Undulation of prepreg after press (GEA-705G1010F78)

Conventional

Prepreg

(t0.020 mm)

　
Item Condition ※2 Unit Actual Value Reference
(IPC-TM-650)
GEA-705G GEA-770G GEA-795G(Type L)
Tg TMA method A °C 250 - 270 260 - 280 260 - 290 2.4.24.5
DMA method A 295 - 305 300 - 330 330 - 350 -
CTE ※1 X (30 - 120 °C) A ppm/°C 9 - 11 8 - 10 5 - 7 2.4.24.5
Y (30 - 120 °C) 9 - 11 8 - 10 5 - 7
T260 (Without Copper) A min ≥60 ≥60 ≥60 2.4.24.1
T288 (Without Copper) ≥60 ≥60 ≥60
Undulation (After Press) A mm 0.0 - 0.3 0.0 - 0.3 0.0 - 0.3 -
  • ※1 Heating Rate: 10 °C/min (Tensile)
  • ※2 Refer to"Condition Note"PDFを開く
  • ※ Above data are experimental results and not guaranteed.

Specifications

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content(%) Dielectric Thickness after Lamination ※1
GEA-705G ― 0.015 1006F70 1006 70±2 0.016 mm
1006F72 72±2 0.017 mm
1006F74 74±2 0.018 mm
1006F76 76±2 0.020 mm
1006F78 78±2 0.022 mm
0.020 1010F74 1010 74±2 0.021 mm
1010F76 76±2 0.023 mm
1010F78 78±2 0.025 mm
1010F80 80±2 0.027 mm
1010F84 84±2 0.035 mm
0.025 1017F73 1017 73±2 0.025 mm
1017F78 78±2 0.031 mm
1017F83 83±2 0.040 mm
GEA-770G ― 0.015 1006F74 1006 74±2 0.017 mm
1006F76 76±2 0.019 mm
1006F78 78±2 0.021 mm
1006F80 80±2 0.023 mm
0.020 1010F67 1010 67±2 0.016 mm
1010F69 69±2 0.018 mm
1010F71 71±2 0.019 mm
1010F73 73±2 0.021 mm
1010F78 78±2 0.026 mm
1010F82 82±2 0.032 mm
0.025 1017F73 1017 73±2 0.026 mm
1017F78 78±2 0.033 mm
1017F83 83±2 0.043 mm
0.030 1027F73 1027 73±2 0.042 mm
1027F78 78±2 0.052 mm
GEA-795G ― 0.020 1010F72 1010 72±2 0.019 mm
1010F74 74±2 0.021 mm
1010F76 76±2 0.022 mm
1010F78 78±2 0.025 mm
1010F80 80±2 0.027 mm
1010F82 82±2 0.030 mm
(L) 0.020 L1010F72 1010 72±2 0.019 mm
L1010F74 74±2 0.021 mm
L1010F76 76±2 0.022 mm
L1010F78 78±2 0.025 mm
L1010F80 80±2 0.027 mm
L1010F82 82±2 0.030 mm
Reference (IPC-TM-650) 2.3.16 ‐
  • ※1) The dielctric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0 %.
    Values change depending on the press condition or inner layer pattern.

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