GEA-705G,GEA-770G
Thin Prepreg with Superior Surface Smoothness
About the product
- Product
- Prepreg
-
GEA-705G,GEA-770G
- Applications
- Semiconductor packages. (FC-BGA, FC-CSP, PoP, SiP)
- HDI, PWB
- Thinner module, PWB
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Features
- Superior in impedance control as prepreg thickness variation is small after press.
- Suitable for fine line formation with its smooth surface.
- Can achieve insulation layer thickness 16 µm.
- Suitable for coreless structure by superior variation of dimensional change.
- Undulation of TYPE-F prepreg is small after press. TYPE-F technology can reduce warpage at assembly.
Characteristics
Surface Smoothness of Prepreg (Microscope)
Panel Warpage of Prepreg after press (w/o copper, by shadow moire)
Prepreg thickness after Press
- Laminate condition
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Sample
- GEA-705G 1010F78
- Copper foil: 3 µm
- Temp.: 230℃100 min
- Heating rate: 3.0℃/min
- Pressure: 3 MPa
- Measurement method
-
Undulation of prepreg after press (GEA-705G1010F78)
Prepreg
- ※1 Heating Rate: 10℃/min.(Tensile)
- ※2 Refer to"Condition Note"
- ※ Above data are experimental results and not guaranteed.
Standard Specification
Prepreg
- ※1) The dielctric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
Values change depending on the press condition or inner layer pattern.
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