MCL-E-679FG(Type R)/(Type S)

Halogen Free, High Elastic Modulus, Low CTE Multilayer Material

About the product

  • Product
    CCL

    MCL-E-679FG(Type R)(Type S)
    MCL-E-679FGB(Type R)/(Type S)〈Black Type〉

    Prepreg

    GEA-679FG

  • Applications
    • Semiconductor packages. (FC-BGA, BGA, CSP)
    • Build up PWB.
    • Personal computer, high density electronic equipment.

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Features

  • Halogen free material for environmental concerns.
  • CTE (Z-direction) is 50% lower than that of our standard FR-4.
  • Elastic modulus is 20% higher than that of our standard FR-4. Even thin laminate has less warpage and deflection.
  • Superior heat resistance for soldering (suitable for lead free process).
  • Suitable for fine patterning with 1/4 surface roughness of our standard FR-4 pattern possible.

Copper Clad Laminate

Through-hole reliability

Test condition: - 55℃, 30 min. ⇔150℃, 30 min.
Pattern: Wall to wall distance 0.3 mm, Laminate thickness: t0.8 mm
Pre-condition: 260℃ reflow × 2times⇒Solder dipping (260℃ 10 sec.)

Stiffness Properties

Prepreg thickness after pattern filling (Inner layer copper 15 µm)

Copper Clad Laminate

                                                                                                                                                                                                                       (t0.4, t0.8mm)

Item Condition ※3 Unit Actual Value Reference
(IPC-TM-650)
MCL-E-
679FGB
(Type R)		 MCL-E-
679FG
(Type R)		 MCL-E-
679FGB
(Type S)		 MCL-E-
679FG
(Type S)
Tg TMA method A ℃ 165–175 175–185 2.4.24
DMA method A 200–220 210–230 ‐
CTE ※1 X (30–120℃) A ppm/℃ 13–15 12–14 ‐
Y (30–120℃) A 13–15 12–14
Z (＜Tg) A 23–33 20–30 2.4.24
(＞Tg) 140–170 130–160
Solder Heat Resistance (260℃) A sec. ≧300 ‐
T-260 (Without Copper) A min. ≧60 2.4.24.1
T-288 (Without Copper) A ≧60
Decomposition Temperature (TGA method 5% Weight Loss) A ℃ 340–360 2.3.40
Heat Resistance for HDI Process 260℃ Reflow cycles ≧10 ‐
Copper Peel Strength 18 µm A kN/m 0.9–1.1 1.1–1.2 2.4.8
35 µm A 1.1–1.2 1.2–1.3
Surface Roughness (Ra) A µm 2–3 2.2.17
Flexural Modulus (Lengthwise) A GPa 23–28 24–29 2.4.4
Dielectric Constant 1GHz ※2 A ‐ 4.8–5.2 5.0–5.2 2.5.5.9
10GHz ※2 4.9–5.1 JPCA TM-001
Dissipation Factor 1GHz ※2 A ‐ 0.0013–0.0015 2.5.5.9
10GHz ※2 0.0014–0.0016 JPCA TM-001
Volume Resistivity C-96/40/90 Ω･cm 1×1014–1×1016 2.5.17
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016 ‐
D-2/100 1×1012–1×1014 ‐
  • ※1 Heating Rate: 10℃/min.(Comp.)
  • ※2 Measured by SPDR method.
  • ※3 Refer to"Condition Note"PDFを開く
  • ※ Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Code Name Laminate Thickness
MCL-E-679FG
MCL-E-679FGB		 (S)
3, 12, 18 µm (LP) T0.07 0.07mm
M0.06 0.07mm
(R)
(S)

3 , 12, 18µm (LP)
12, 18 , 35 µm (STD)

 0.1 0.11mm
0.2 0.20mm
0.41 0.40mm
0.81 0.80mm

Note1) STD: Standard copper foil, LP: Low profile copper foil.

Note2) “T” for 2-ply.

Note3) Laminate thickness means  dielectric layer thickness.

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)		 Dielectric Thickness
after Lamination ※1 
GEA-679FG ※2 (R) 0.03 (GBPE) 1027 73±2 0.040 mm
0.04 (GRZPE) 1037 73±2 0.048 mm
0.06 (GRROE) 1078 68±2 0.079 mm
0.1 (GRSKE) 2116 58±2 0.127 mm
(S) 0.03 (GSBPE) 1027 73±2 0.040 mm
0.03 (GSBSE) 1027 78±2 0.050 mm
0.04 (GSZPE) 1037 73±2 0.048 mm
0.06 (GSROE) 1078 68±2 0.079 mm
0.1 (GSSKE) 2116 58±2 0.127 mm
Reference (IPC-TM-650) 2.3.16 ‐
  • ※1 The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
    Value changes depending on the press condition or inner layer pattern.
  • ※2 Black type is not available for prepreg.

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