Photosensitive Film for Thick Film Resist Formation
Photec | HM Series
About the product
Resonac’s photosensitive materials designed to form thick resist pattern layers are used for such applications as the copper plating process of printed wiring boards requiring a high aspect ratio and electroforming in metal mask manufacturing.
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Benefits
- Superior resolution/adhesion, and is capable of forming resists with a thickness more than double the hole diameter and line width.
- Offers a thick film lineup (35 - 168 µm) in response to various applications.
- Superior chemical resistance, and applicable as a resist for copper plating and electroplating.
- Responds to development with standard sodium carbonate solutions and peeling solutions used for printed wiring boards.
- Provides smooth sidewall shapes.
Characteristics
(One of our data)
| Item | Unit | HM-4000series (For Contact Exposure) | ||
|---|---|---|---|---|
| HM-4056 | HM-4075 | HM-40112 | ||
| Resist thickness | µm | 56 | 75 | 112 |
| Exposure energy | mJ/cm2 | 85 | 130 | 270 |
| Extra high pressure mercury lamp*1 | ||||
| Adhesion(L/S=x/400) | µm | 22 | 35 | 32 |
| Resolution(L/S=x/x) | µm | 25 | 35 | 50 |
- ※1 Collimated light type
Resist Profile
HM-4056
Resist thickness：56 µm
Φ = 30 µm
HM-40112
Resist thickness：112 µm
L/S=180 µm/30 µm
HM-40112
Resist thickness：112 µm
Resist diameter: Φ = 30 µm (Space: 40 µm)
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