Photosensitive Film for Package Substrate Circuit Formation
Photec RY Series
About the product
Resonac’s photosensitive resist materials designed to form fine-pitch circuits on semiconductor package substrates can form circuits with a film thickness of 10 um or less and a width of 4 um or less.
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Merits
- Provides excellent shaped resist profiles, and is capable of forming fine-pitch circuits based on film thickness.
- Responds to circuit formation by semi-additive processing.
- Responds to resist patterning using a stepper exposure machine.
Characteristics
(One of our data)
| Item | Unit | RY-5107UT | RY-5110UT | RY-5825 |
|---|---|---|---|---|
| Resist thickness | µm | 7 | 10 | 25 |
| Minimum developing time | Sec. | 7 | 10 | 23 |
| Exposure energy | mJ/cm2 | 200 | 200 | 120 |
| Adhesion (L/S=x/3x) | µm | ≦3 | 4 | 6 |
| Resolution (L/S=x/x) | µm | ≦4 | 4 | 6 |
Projector machine; i-line projector
Developing conditions; 1.0 wt% Na2CO3aq, 30 ℃, Minimum developing time×2
Resist profile
RY-5107UT
(L/S= 4 μm / 4 μm)
Substrate surface roughness
Ra:100 nm
RY-5107UT
(L/S= 2 μm / 2 μm)
Substrate surface roughness
Ra:10 nm
RY-5825
(L/S= 6 μm / 6 μm)
Substrate surface roughness
Ra: 100 nm
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