Photosensitive Film for Circuit Formation in Direct Imaging
Photec | RD Series
About the product
Resonac’s resist materials for forming printed wiring board circuits are applicable to direct-writing exposure machines that pattern circuits using laser beams.
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Benefits
- Provides excellent shaped resist profiles, and is capable of forming fine-pitch circuits based on film thickness.
- Responds to circuit formation by semi-additive processing.
- Applicable to direct-writing exposure machines.
Product Lineup
(One of our data)
| Item | Unit | RD-3015 | RD-3019 | RD-3025 |
|---|---|---|---|---|
| Resist thickness | µm | 15 | 19 | 25 |
| Exposure energy | mJ/cm2 | 95 | 95 | 85 |
| Recommended step held | x/41ST | 15 | 15 | 15 |
| Adhesion (L/S=x/3x) | µm | 4 | 5 | 7 |
| Resolution (L/S=x/x) | µm | 4 | 5 | 7 |
- ※ DE-1 UH was applied(Adtec Engineering Co.,Ltd, 405 nmDI)
Substrate roughness Ra: 0.4 µm
Post exposure bake (P.E.B): 80 °C, 30 s (Box Oven)
Developer: 1.0 wt% Na2CO3 (aq), 30 °C, 0.16 MPa
Resist Profile
RD-3015 (L/S=4 µm/4 µm)
RD-3019 (L/S=5 µm/5 µm)
RD-3025 (L/S=7 µm/7 µm)
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