Base Materials for Packages
About the product
Resonac’s base materials for mounting semiconductor devices and packages fit the requirements of larger flip chips, including 2.xD packages, and thinning of packages such as SiP or AiP.
The wide ranging product lineup includes models for high-frequency devices, and enjoys a high market share and penetration for flip chip BGA applications.
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Merits
- Reduces substrate warpage during semiconductor package assembly with low thermal expansion and high elasticity.
- Enables ultra-thin, flat devices with TYPE-F technology and increases connection reliability.
- Applicable to build-up structures with excellent thermal resistance.
- Ease of drilling contributes to lower process costs.
- Environmentally friendly containing no halogen.
- Models designed for high-speed communications exhibit low dielectric properties and fit high-frequency applications.
MCL-HD60/HD90 with high-dielectric properties improve antenna performance with package miniaturization.
Product lineup
| Product name | CTE(x,y) | CTE(z) | Tg | Dk(10GHz) | Df(10GHz) |
|---|---|---|---|---|---|
| MCL-E-795G | 3~5 | 10~15 | 260~290 | 4.2~4.4 | 0.006~0.008 |
| MCL-E-705G | 5~7 | 10~15 | 250~270 | 4.4~4.6 | 0.009~0.011 |
| MCL-E-700G(Type R) | 8~10 | 15~25 | 250~270 | 4.6~4.8 | 0.008~0.010 |
| MCL-E-679FG | 13~15 | 23~33 | 165~175 | 4.5~4.7 | 0.018~0.020 |
| MCL-E-770G(Type R) | 4~6 | ー | 260~280 | 4.2~4.4 | 0.006~0.008 |
GEA-705G |
8~10 | ー | 250~270 | ー | ー |
| GEA-770G |
6~7 | ー | 260~280 | ー | ー |
| MCL-HD60/HD90 | 11/12 | ー | 240 | 6.2/9.2 | 0.0056/0.0050 |
| MCL-HS200 | 8~10 | 25~35 | 220~240 | 3.2~3.4 | 0.0020~0.0030 |
| MCL-HS100 | 6~8 | 20~30 | 240~260 | 3.5~3.7 | 0.0025~0.0035 |
| GH-200(Type D) |
8~10 | 25~35 | 220~240 | 3.2~3.4 | 0.0020~0.0030 |
| GH-100(Type D) |
6~8 | 20~30 | 240~260 | 3.5~3.7 | 0.0025~0.0035 |
| MCF-200HS | 35~40 | ー | 250~270 | 2.9~3.1 | 0.0030~0.0040 |
| PF-EL | 12~15 | 50~80 | 200~215 | 4.1~4.3 | 0.0130~0.0150 |
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