Copper Clad Laminates (CCL) & Prepregs for Semiconductor Packages

About the product

Resonac’s copper clad laminates (CCL) and prepregs for semiconductor packages support the increasing size of flip chip packages, including 2.xD packages, as well as the thinning of packages such as SiP and AiP. Their low coefficient of thermal expansion (low CTE) and high elastic modulus effectively suppress substrate warpage during manufacturing and assembly processes. We offer a wide range of products, including high-frequency compatible grades, and hold a high market share and proven track record especially in flip chip BGA applications.

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Benefits

  • Reduces substrate warpage during semiconductor package assembly with low thermal expansion and high elasticity.
  • Enables ultra-thin, flat devices with TYPE-F technology and increases connection reliability.
  • Applicable to build-up structures with excellent thermal resistance.
  • Ease of drilling contributes to lower process costs.
  • Environmentally friendly containing no halogen.
  • Models designed for high-speed communications exhibit low dielectric properties and fit high-frequency applications.

Product Lineup

Product name CTE (x,y) CTE (z) Tg Dk (10 GHz) Df (10 GHz)
MCL-E-795G 3 - 5 10 - 15 260 - 290 4.2 - 4.4 0.006 - 0.008
MCL-E-705G 5 - 7 10 - 15 250 - 270 4.4 - 4.6 0.009 - 0.011
MCL-E-700G (Type R) 8 - 10 15 - 25 250 - 270 4.6 - 4.8 0.008 - 0.010
MCL-E-770G (Type R) 4 - 6 ー 260 - 280 4.2 - 4.4 0.006 - 0.008
GEA-705G 8 - 10 ー 250 - 270 ー ー
GEA-770G 6 - 7 ー 260 - 280 ー ー
MCL-HS20N 8 - 10 25 - 35 220 - 240 3.2 - 3.4 0.0020 - 0.0030
GH-200(Type D) 8 - 10 25 - 35 220 - 240 3.2 - 3.4 0.0020 - 0.0030
MCF-200HS 35 - 40 ー 250 - 270 2.9 - 3.1 0.0030 - 0.0040
MCF-770G(Type P) 18 - 20 ー 290 - 310  3.2 - 3.3 0.0060 - 0.0080
PF-EL 12 - 15 50 - 80 200 - 215 4.1 - 4.3 0.0130 - 0.0150

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