Epoxy Molding Compounds for Organic Substrates

CEL Series

About the product

Resonac’s epoxy molding compounds is suitable for semiconductor packages assembled with organic substrates such as BGA and CSP.

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Merits

  • Control package warpage by controlling the elastic modulus and thermal expansion.
  • Excellent reflow resistance with superior thermal resistance and adhesiveness.
  • Applicable to transfer molding underfill (MUF).
  • Applicable to low Dk/Df requirement for high frequency applications such as 5G.
  • Excellent filling ability in small gaps as in SiP modules.
  • Applicable to compression molding.

Applicable packages: CSP, BGA, Stacked MCP, etc.

Characteristics

Item Unit CEL-9750
ZHF10HT3W
CEL-9750
ZHF10
CEL-9750
HF10
CEL-9700
HF10
Applications - BGA,CSP
Flame retardant system - No flame retardant No flame retardant No flame retardant No flame retardant
Spiral flow cm 185 150 145 110
Glass transition temperature 145 150 140 125
Thermal expansion α1 ppm/℃ 12 7 7 6
α2 ppm/℃ 41 27 29 27
Flexural modulus GPa 27 26 27 27
Mold shrinkage % 0.18 0.08 0.1 0.1
Thermal conductivity W/mK 3 - - -
Item Unit CEL-1702
HF13
CEL-1802
HF19
GE-100 GE-110
Applications - BOC BOC BGA,CSP
Flame retardant type - Metal-based Organic phosphorous Metal-based Metal-based
Spiral flow cm 90 90 190 165
Glass transition temperature 125 120 145 155
Thermal expansion α1 ppm/℃ 12 9 9 9
α2 ppm/℃ 45 36 38 35
Flexural modulus GPa 16 17 23 22
Mold shrinkage % 0.32 0.35 0.1 0.08
Thermal conductivity W/mK - - - -

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