Thermally Conductive Filler Materials (Alumina & Hexagonal Boron Nitride)
Major Application
Thermally conductive filler materials
About the product
Our thermally conductive fillers are widely used in insulating thermal conductive sheets and liquid thermal conductive materials for electronic components. Resonac offers alumina fillers in various shapes and sizes to meet diverse needs, as well as boron nitride fillers known for their excellent thermal conductivity.
These reliable thermal fillers have been utilized globally for many years.
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Features
- A wide variety of options in shape and particle size (Alumina fillers)
- Thermal fillers can be selected and formulated based on the required properties of thermal materials, such as: Thermal conductivity, Thickness, Viscosity, Long-term stability
- Customized particle size designs and adjustments are available to meet specific application requirements.
Lineup
Low-soda Alumina (AL Series)
The AL series is α-alumina which has reduced soda content, controlled by our proprietary technology. Extra fine alumina particles are used as an ingredient in resins alongside coarse ingredients.
Features
- Fine particles (submicron to 3 μm)
- Low Soda (≤0.10 %)
- Good dispersibility
- Thixotropic properties

Roundish Alumina (AS Series)
The AS series is a single-grained alumina with less crystal edges. Due to its large particle size and broad particle size distribution, it enables the production of compounds with excellent fluidity and stability.
Features
- Coarse particles (9 - 36 μm)
- High fillability
- Stability
- High thermal conductivity

Spherical Alumina (Alunabeads CB Series)
The CB series is a spherical single-grained alumina. CB produces compounds with high filling rates and good viscosity. The CB series is featuring various particle sizes and particle distributions to meet your requirements.
Features
- Fine to coarse grains (2 - 100 μm)
- A wide range of particle sizes
- Low specific surface area
- High filling capacity

Hexagonal Boron Nitride (SHOBN UHP Series)
SHOBN, our UHP series is a high purity crystalized Hexagonal Boron Nitride. SHOBN has excellent thermal conductivity, high thermal stability, corrosion resistance, and good electrical characteristics (high electrical insulation, low dielectric constant).
Features
- High purity
- Low hardness, low specific gravity
- High thermal conductivity
- High insulation properties & low dielectric constant

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