Low Chlorine Epoxy Monomer
Shofree
About the product
Resonac supplies Shofree, a low-chlorine epoxy monomer manufactured using its proprietary process that does not employ organochlorine compounds.
Compared with the conventional epichlorohydrin process, this technology significantly reduces the halogen content in the epoxy monomer and achieves zero organochlorine compounds.
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Applications
- Functional additive (reactive diluent)
- Underfill materials
- Die-bonding materials
- Conductive adhesives
Use Example
Features
- Significantly reduced chlorine content, contributing to excellent electrical reliability
- Multifunctional and low viscosity, suitable for use as either a principal component or an additive component
- High purity, contributing to high glass transition temperature (Tg) and heat resistance
Synthesis of Epoxy Monomers via Allyl Ether Oxidation
Epoxy Monomer Synthesis Technology Based on Oxidation Process
Lineups
| Grade | CAS No | Chemical Name | Molecular Structure Formula |
|---|---|---|---|
| Shofree PETG | 3126-63-4 | Epoxidized reaction product of pentaerythritol tetraallyl ether with hydrogen peroxide |
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| Shofree CDMDG | 14228-73-0 | 1,4-Cyclohexanedimethanol diglycidyl ether |
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| Shofree BATG | 1799411-80-5 | Epoxidized reaction product of 2,2'-diallylbisphenol A diallyl ether with hydrogen peroxide |
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Characteristics
Monomer Properties
| Item | Unit | PETG | CDMDG | BATG | BisA-EP | Test Method | ||
|---|---|---|---|---|---|---|---|---|
| Resonac | Competitor | Resonac | Competitor | Resonac | Competitor | |||
| Color | - | Colorless | Pale yellow | Colorless | Pale yellow | Brown to dark brown | Colorless to Pale yellow | Visual inspection |
| Appearance | - |
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| Viscosity (30 °C) | mPa⋅s | 310 | 750 | 30 (25 °C) | 37 (25 °C) | 112,000 | - | E-type viscometer |
| Epoxy equivalent weight | g/eq | 90 - 100 | ~ 240 | 136 | 135 | 120 - 128 | 177 | Titration method |
| Chlorine content | ppm | <50 | ~ 5 % | 4.8 | 503 | <50 | >900 | Ion chromatography |
Electrical Reliability
High electrical reliability due to its halogen-free composition.
| Evaluation | Migration Test |
|---|---|
| Test Conditions | Temperature: 85 °C, Humidity: 85 %RH Voltage: 100 V L/S ＝ 50/50, Pitch Width: 100 μm |
Purity
| Item | GPC Chromatogram | NMR Spectrum |
|---|---|---|
| PETG |
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| Competitor |
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Properties of Cured Resins
| Curing Conditions | Catalyst: Curezole 2E4MZ (1 wt%) 150 °C / 1 h + 200 °C / 2 h |
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