Price adjustment of Copper Clad Laminates and Prepregs

January 16, 2026
Resonac Holdings Corporation

Resonac Corporation (President and CEO: Hidehito Takahashi, hereafter referred to as “Resonac”) has decided to increase the sales prices of copper-clad laminates and prepregs, which are primarily used for electronic circuit boards, as outlined below.

 

1. Details of the Price Revision
①Target Products and Rate of Increase :
Copper-clad laminates and prepregs (all products)
30% increase from the current prices

②Effective Date :
Shipments from March 1, 2026 onward

 

2. Background of the Price Revision
In addition to the sharp rise in prices of raw materials such as copper foil and glass cloth due to supply-demand constraints, labor costs and transportation expenses have increased significantly, creating a very challenging business environment. Although the Company has implemented various measures to reduce costs, in order to ensure a stable supply of these products and to continue providing new technologies, we have come to the unavoidable conclusion to request this price revision.

 

3. Product Applications
Copper-clad laminates and prepregs are materials used in the manufacture of electronic circuit boards. They are widely used in electronics products such as PCs and home appliances.

For further information, contact

Media Relations Group, Brand Communication Department