We held a press conference to announce the establishment of US-JOINT

August 09, 2024
Resonac Holdings Corporation

On July 8, Resonac announced the establishment of the new consortium 'US-JOINT' in Silicon Valley, USA, in the field of next-generation semiconductor packaging, comprising 10 companies from Japan and the United States involved in materials and equipment. Detailed information was provided by Hidenori Abe, Executive Officer of Resonac and Deputy General Manager of the Electronics Business Headquarters, at US-JOINT establishment press conference held on the same day, so please watch the video.

You can view the news release at the following link.
 https://www.resonac.com/news/2024/07/08/3116.html