Resonac Gives Presentation on Its Effort to Strengthen Supply Chain at Japan-Malaysia Public Private Industrial Policy Dialogue
April 06, 2023
Resonac Holdings Corporation
On April 3, 2023, Resonac Corporation (Tokyo: 4004) (President: Hidehito Takahashi) took part in “Japan-Malaysia Public Private Industrial Policy Dialogue” held in Kuala Lumpur, Malaysia, and gave a presentation on its effort to strengthen supply chain for semiconductor materials.
The first Japan-Malaysia Dialogue was hosted by the Ministry of Economy, Trade and Industry of Japan (METI) and Ministry of International Trade and Industry of Malaysia as an action to implement “ASIA-Japan Investing for the Future Initiative,” which was announced by METI in January 2022 as a new initiative to provide the direction for economic cooperation in Asia with a view toward the post-pandemic era. At the meeting of this time, advanced actions to strengthen supply chains were presented, and an exchange of views on those cases followed.
METI has been promoting the Program to Strengthen Supply Chains in Indo-Pacific Region, which is a subsidy program to support research on overseas market based on a supplementary budget for fiscal 2021. Resonac gave a presentation on its effort to strengthen supply chain for semiconductor materials because it has been making effort to realize visualization and integrated management of information about supply chains by utilizing this subsidy program.
Presenters of the Resonac Group’s case were Eiji Ibuka, Deputy General Manager, Global Supply Chain Management Center, Electronics Business Headquarters, Resonac Corporation, and Takatoshi Ikeuchi, Managing Director, Resonac Materials Malaysia Sdn. Bhd. They explained the importance of reinforcement of supply chain for semiconductor materials to cope with various problems including environmental problems, restrictions on production and logistics, and geopolitical risks. And they introduced Resonac’s construction of database which aims to realize integrated management of information about supply chain of semiconductor materials ranging from suppliers of materials to customers. In addition, Resonac asked Ministry of International Trade and Industry of Malaysia for the Ministry’s cooperation on execution of measures to strengthen management of supply chains, including recruitment of highly-motivated and knowledgeable engineer especially in Kuala Lumpur, Penang, and Johor Bahr, where the Resonac Group has its bases, and the Ministry’s advice and support for the Group’s effort to protect environment.
On April 4, the next day of the meeting, the delegation of Trade Policy Bureau, METI, visited Selangor Plant of Resonac Materials Malaysia Sdn. Bhd. and explored around the manufacturing site of epoxy molding compound and R&D Center. After the visit, Nobuo Kiriyama, Deputy Director-General for Trade Policy, METI, commented “Thank you very much for introducing a good supply chain case to mitigate risk and disruption.”
As a manufacturer of semiconductor materials which are defined as specified important materials under the Economic Security Promotion Act, the Resonac Group will contribute to stable supply of semiconductor materials and prosperity of the industry, and will visualize and improve supply chains in Southeast Asia.
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