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The “US-JOINT” Consortium Officially Kicks Off: Opening Ceremony Report

May 12, 2026

The consortium “US-JOINT,” which aims to establish a new technology development model in the field of next-generation semiconductor packaging, has officially entered full-scale operation in Silicon Valley, the United States. This article reports on the opening ceremony of its R&D Center, held on April 20, 2026 (local time).

Government Officials and Executives from Participating Companies in Japan and the U.S. Attend

“US-JOINT” is a consortium led by Resonac, comprising 12 Japanese and U.S. companies including materials and equipment manufacturers. It is the first consortium in the United States dedicated specifically to advanced semiconductor packaging. Established in 2024, the consortium aims to accelerate the verification of cutting-edge semiconductor packages concepts, as well as research and development in materials, evaluation, and assembly technologies, by leveraging its R&D Center in Silicon Valley and working closely with customers.

In April 2026, the Silicon Valley R&D Center was completed, and an opening ceremony was held at the site. Government officials from Japan and the United States, along with executives from participating companies, attended the ceremony and shared their expectations for and aspirations toward US-JOINT.

US-JOINT Participating Companies (in alphabetical order):
Azimuth Industrial Co., Inc., KLA Corporation, Kulicke and Soffa Industries, Inc., MEC COMPANY LTD., Moses Lake Industries, NAMICS Corporation, TOKYO OHKA KOGYO CO., LTD., TOPPAN Inc., TOWA Corporation, ULVAC, Inc., 3M Company, Resonac Corporation

Perspectives on US-JOINT Shared by Ceremony Attendees

Hidehito Takahashi, President and CEO, Resonac Holdings Corporation 
“US-JOINT accelerates global semiconductor innovation through U.S.–Japan collaboration.”

Hidenori Abe, Corporate Officer, CTO for Semiconductor Materials, Resonac Holdings Corporation; Deputy General Manager, Electronics Business Headquarters, Resonac Corporation
“Our goal is to reduce the timelines of Proofs of Concept from six months to one month. The benefits for hyperscalers definitely include proximity and short distance.”

Muneo Miura, President and Chief Executive Officer, TOWA Corporation 
“By joining US-JOINT, we can achieve real performance improvement, and more importantly, visible value to our customers.”

David Lee, Chief Executive Officer, Azimuth Industrial Co., Inc. 
“A bold idea, shared leadership, and partnerships made US-JOINT possible.”

Kazumi Nishikawa, Deputy Director General for Semiconductor and Information Policy, Ministry of Economy, Trade and Industry, Japan 
“US-JOINT is just the start of innovation for advanced packaging and chiplets in generative AI computing.”

Kotaro Otsuki, Consul General, Consulate of Japan in San Francisco
“I look forward to the innovations generated by the facility and contribution of US-JOINT to the development of California.”

Emily Desai, Chief Deputy Director, The Governor’s Office of Business and Economic Development (GO-Biz) , State of California
“US-JOINT is a critical reminder of the role that international trade plays for the California economy.”

Gary Singh, Mayor of Union City
“Today is a historic day for Union City, the semiconductor industry, and for consumers whose daily use of devices depend on US-JOINT’s technology.”

The US-JOINT R&D Center Enters Full-Scale Operation

The R&D center where the ceremony was held is located in Union City, California. It is a state-of-the-art facility with advanced manufacturing equipment for semiconductor packaging processes—including patterning, bonding, molding, and plating—as well as evaluation and analysis equipment and cleanrooms (Class 100 and Class 1,000). Following the ribbon-cutting ceremony, attendees were invited to tour the facility.

At US-JOINT, not only engineers from participating companies but also engineers from fabless companies and semiconductor manufacturers gather at this facility to jointly validate concepts for next-generation semiconductor packaging. Through this collaborative approach, US-JOINT aims to significantly shorten the lead time for proof of concept (PoC)—for example, reducing a process that previously took six months to just one month.