Resonac, a global leader in semiconductor back-end materials, has launched the Japan-U.S. consortium “US-JOINT” in Silicon Valley, home to GAFAM and major semiconductor companies.

The key leader behind the consortium is Hidenori Abe, Executive Director of the Electronics Business Headquarters at Resonac, who started his career as an engineer. In the following story, Abe-san will describe the journey and challenges he encountered while creating the US-JOINT consortium.

Strengths of a materials manufacturer nurtured through co-creation with customers

In the 1980s, Japan’s semiconductor industry, known as “Hinomaru Semiconductor,” led the world in leading technology. Although Japanese manufacturers have since lost their prominence, they remain highly competitive in the global semiconductor materials and equipment markets.

Resonac holds a top global share in several back-end materials, developed through close collaboration with semiconductor manufacturers. I prioritizes communication with customers that emerge new products that tailor solutions based on customer needs. Understanding the customer manufacturing processes and material needs is challenging. Their feedback helped address their requirements in a timely and accurate manner.

Different culture inspires a big dream

In my late twenties, I focused on business development to understand customers' wants and needs. This experience greatly influenced my current goals and objectives.

After spending time in the U.S., I noticed a cultural difference from Japan. The U.S. semiconductor industry is actively exchanging information and ideas through strong personal connections. These networks were often formed at the individual level, likely due in part to cultural factors and the workforce's mobility. In contrast, Japan’s work culture tends to be monogamous in which no connections are formed beyond the company. I wanted to bring the practices he learned in the U.S. back to Japan and establish a consortium that would adopt these collaborative practices.

Building trust and engaging competitors

In 2020, I was appointed to serve as the director of the Packaging Solution Center and tasked with promoting open innovation. During this time, an opportunity to launch JOINT2, a consortium for the development of next-generation semiconductor packaging technologies was developing.
The development started without a detailed plan or schedule but only a concept. When visiting potential partners, I intentionally did not prepare any materials but instead shared my philosophy for the US-JOINT consortium. After discussions and examinations, the potential partners would start sharing their honest opinions that gradually determine the direction of the consortium and establish a collaborative relationship.