Business Strategies - SiC Epitaxial Wafers

Relationship Between Our Products and Daily Life

SiC epitaxial wafers are mainly used as substrates for power semiconductor devices and contribute to energy conservation in various fields, such as renewable energy and electric vehicles (EVs).

Mission of SiC Epitaxial Wafers Business

As the world’s largest independent supplier and technology leader of SiC epitaxial wafers, key materials for improving the performance of the growing SiC power semiconductors, we will strive to provide solutions while co-creating with customers to help realize energy conservation around the world.

Initiatives to Strengthen Competitiveness and Examples

We will make use of Resonac’s strengths and competitive advantages to become a world-class functional chemical company and a company that can compete on the world stage by 2030.

Strengths as a Manufacturer Specialized in Epitaxial Wafers

As a manufacturer specialized in epitaxial wafers that does not handle SiC devices, we attract device manufacturers that manufacture wafers and epitaxial wafers in-house as customers. This unique business model allows us to improve quality and accumulate expertise by gathering the needs of multiple customers and aligning specifications. In 2022, we began test shipments of eight-inch (200 mm) SiC epitaxial wafers, which contribute significantly to larger wafer diameters while enabling us to achieve industry-leading quality by fully utilizing technology that reduces defects.

Utilization of IP Landscape in SiC Epitaxial Wafers Businesses and Evaluation of Intellectual Property Value

The value of our patents (PAI = Patent Asset Index*: registered trademark of Lexis Nexis) in the field of SiC epitaxial wafers, acquired as a result of our pioneering technological developments, more than doubled that of industry peers in 2024, demonstrating our competitive advantage. Furthermore, France-based KnowMade, which specializes in the analysis of patents and scientific information, highly rated our IP position in the development of larger diameter, low-defect SiC epitaxial wafers.

  • * Evaluation of valid patents using Lexis Nexis’ PatentSight+ patent database; PAI is calculated based on Technology Relevance of each patent and Market Coverage.

Vision for 2030 and Roadmap to Achieve It

Vision for the future(2030) Issues to Be Addressed Results in 2024 Plans for 2025
  • SiC epitaxial wafer technology leader to lead the industry’s technological innovation
  • Provision of high-quality products and solutions that meet the customer (power semiconductor manufacturers) demands for more advanced and specialized chips
  • Maintaining “Best in Class” for eight-inch (200 mm) SiC epitaxial wafers, demand for which is growing rapidly in automotive applications
  • Maintaining and expanding our technological advantages (industry-leading low levels of surface defect density and basal-plane dislocation, etc.)
  • Strengthening technology collaborations and our ability to align with customers
  • Differentiating from rivals, and improve productivity of eight inch SiC epitaxial wafers
  • Sales grew due to increased shipments of SiC epitaxial wafers
  • Commenced reliability testing of epitaxial wafers for power devices in addition to the evaluation of  materials for power modules at the Power Module Integration Center (PMiC)
  • Constructed a new production building for SiC wafers at Resonac Hard Disk’s Yamagata Plant (scheduled for completion in September 2025)
  • Enhance ability to supply high-quality SiC epitaxial wafers  to meet customer requirements inline with growth of the power semiconductor market
  • Accelerate technology development to realize “Best in Class” in mass production of eight inch SiC epitaxial wafers