Business Strategies - Front-end / Back-end Semiconductor Materials

Mission of Front-end / Back-end Semiconductor Materials Business

Through our strengths, which include a wide range of products and co-creation with industry peers, we are able to quickly catch up with changes in the industry to create high-value-added products that meet customer needs.
This contributes to continuous business expansion, which drives Resonac’s growth into a world-class functional chemical company.

Strengths and Competitive Advantages for the Achievement of the Long-Term Vision

We will make use of Resonac’s strengths and competitive advantages to become a world-class functional chemical company and a company that can compete on the world stage by 2030.

  • Because we have a lineup of products that cover a wide range of materials from front-end to back-end semiconductor materials and we own several products that command the top market share, we can anticipate growth exceeding the increase in the number of chips as the number of components used rises with the higher integration of semiconductors
  • With data volume increasing as demand for semiconductors for AI rises, the semiconductor design process is becoming even more sophisticated and complex. Against this backdrop, our strong ability to propose back-end materials enables us to respond flexibly to customer requirements
  • Japan and the U.S. lead JOINT, a consortium of material, equipment, and substrate manufacturers aimed at establishing next-generation semiconductor packaging and evaluation technologies. We use our expansive network to quickly grasp changes and create high-value-added products that meet the needs of our customers

Strategies of Front-end / Back-end Semiconductor Materials Business for the Achievement of the Long-Term Vision

  • AI semiconductors are expected to achieve substantial growth. In response, we will enhance our R&D capabilities not only in Japan but also in the United States so that we can supply outstanding materials for use in leading-edge semiconductors.
  • Also, now that the semiconductor packaging density can no longer be further increased in the front-end process, the advancement of the back-end process is attracting attention with regard to achieving higher-density semiconductor devices. We have world-class back-end materials as our strength and by taking advantage of this we will contribute to the further advancement of semiconductors.
  • Moreover, we will build a resilient global supply chain management system for the earlier detection of risks and the stable supply of our products to customers.

Vision for 2030 and Roadmap to Achieve It

Vision for the future(2030) Issues to Be Addressed Results in 2023 Plans for 2024
  • Supply advanced semiconductor materials to support the advancement of the digital society, such as the rapidly growing AI demand, and realize a sustainable society by contributing to energy conservation and reducing environmental impacts
  • Driving the industry and become a leader in co-creation as the world-class manufacturer of back-end semiconductor materials
  • Strengthening product capabilities centered on advanced semiconductor materials
  • Building a robust supply chain management system immune to geopolitical risks
  • Net sales and income decreased year-on year due to continued weakness in the semiconductor market from the second half of 2022
  • Adopted by the Ministry of Economy, Trade and Industry’s “Project to Support the Advancement of Supply Chains using Digital Technology”
  • Participated in the Texas Institute for Electronics (TIE), a U.S.-based consortium for semiconductor innovation
  • Completed the introduction of our domestic SCM reinforcement system for major products
  • Started preparations for the establishment of an R&D base in Silicon Valley, U.S.,a hub for prominent semiconductor manufacturers
  • Strengthen the revenue base by revamping our product portfolio and working for speedy fruition of our investment efforts to increase production
  • Decide on investments to increase domestic production of new materials such as NCF insulating adhesive films for HBM and TIM heat dissipation sheets for 2.xD packages
  • Implement specific measures against climate change and geopolitical risks
  • Strengthen and implement our global R&D and key account strategies, and marketing capabilities
  • Place further focus on fostering our organizational culture and developing human resources through workplace environment development and workshops, etc.
  • Introduction of global supply chain management enhancement system

TOPICS 2024 of Front-end / Back-end Semiconductor Materials Business

Participation in TIE, the cutting-edge semiconductor consortium

In 2023, we became the first Japanese manufacturer and material manufacturer to participate in the consortium of semiconductor manufacturers “Texas Institute for Electronics” (hereinafter “TIE”) based in Texas, U.S. TIE is a non-profit organization consisting of public- and private-sector companies that aims to advance the roadmap of cutting-edge semiconductor technology by five years. We were invited to participate due to our strengths being recognized. By participating in TIE, we aim to co-create with other companies and contribute to solving problems through the research and development of cutting-edge technologies.

Resonac Plans to Establish Semiconductor Back End Process R&D Center in Silicon Valley

Resonac aims to accelerate development of cutting-edge technologies in a region where business bases of GAFAM and US semiconductor manufacturers are concentrated.

Establishment of US-JOINT, a consortium for the development of next-generation semiconductor packaging technology in the U.S.

We plan to establish a consortium in Silicon Valley, U.S., in which ten materials- and equipment-related companies from Japan and the U.S. will collaborate on next-generation semiconductor packaging. In next-generation semiconductors, packaging technology for back-end processes is gaining attention, resulting in the rapid advancement of packaging technologies such as 2.5D and 3D.
Through US-JOINT, Resonac will co-create with customers and participating companies to verify the latest semiconductor package concepts and accelerate the R&D of materials and evaluation/mounting technologies by gaining insight into market needs in real time.

Resonac Participates Semiconductor Assembly Test Automation and Standardization Research Association (SATAS)

SATAS accelerates development of technologies for leading-edge semiconductor packaging by utilizing expertise and experience in leading-edge packaging.

Solution of Social Issues through Business Operations

Business/Product How to contribute to society Related SDGs
Semiconductor materials Help increase data capacity and communication speed, thereby contributing to the creation of a sustainable global society 9、7、12、11、9、13
Copper-clad laminates, solder resist and high-purity gas Promote the advancement of digital communication technologies, enable the widespread use of data infrastructure and reduce environmental impacts 9、13