Business Strategies - Front-end / Back-end Semiconductor Materials
Products Line-up
“Structure-based” proposal capabilities realized through advanced semiconductor materials and evaluation foundations. In addition to our broad lineup of products with high market share, we will leverage our World-Class packaging evaluation foundation to move toward material proposals “created proactively” starting from packaging structures

- ※ Source: Fuji Chimera Research Institute “2024 Electronics Packaging New Materials Handbook,” Copper Clad Laminate for Package 2023 actual (value basis), Dry Film Resist 2023 actual (shipping value basis), Encapsulant 2023 actual (volume and value basis), Underfill for Primary Jisso 2023 actual (volume and value basis); Photosensitive insulation materials*, Buffer coating materials and rewiring materials 2023 actual (volume:* products of HD MicroSystems L.L.C., a group company)
- ※ Source:Fuji Keizai “2025 Semiconductor Materials Market: Current Status and Future Outlook”: Die bonding film, 2024 actual results (volume); CMP slurry (for STI), 2024 actual results (value)
Strength of This Business (Resonac Pride Products and Services)
Packaging and Power Solution Center (Shinkawasaki)
・Degree of contribution to the environment through improved semiconductor package performance
・JEvolution of co-creation at JOINT3
・Business creation capability

Medium- to Long-Term Vision of Front-end / Back-end Semiconductor Materials
With an eye to realizing a society in which humans and AI co-create, as a leading semiconductor materials company that proposes solutions based on deep insight into chemistry and an understanding of semiconductor devices, we will contribute to accelerating the development of advanced devices that realize a sustainable society.

Vision for 2030 and Roadmap to Achieve It
Semiconductor market driven by generative AI
The semiconductor market is expanding amid the spread of generative AI, with AI-related applications driving growth in particular. The market structure is undergoing a major shift from being traditionally non-AI-centric to being AI-driven.

Changing Society: Specific Example
With the rapid expansion of generative AI, cloud computing, and data centers, society is calling for advanced information processing at an unprecedented speed. Semiconductors, which play a central role in this, not only require miniaturization and high-level integration, but also the tackling of complex challenges such as reducing power consumption, heat dissipation, and reliability. At Resonac, we have evolved our solution proposals starting from the packaging structures, leveraging our strengths in a range of materials covering front-end to back-end processes and our World- Class evaluation and analysis foundations. Through co-creation with semiconductor manufacturers, fabless companies, equipment manufacturers, and materials manufacturers, we are transforming development processes that were previously fragmented across individual companies, achieving a new development model that optimizes everything from semiconductor package design to evaluation in an integrated manner. This simultaneously enables high performance while reducing the power consumption of AI servers, contributing to improved energy efficiency across the entire digital infrastructure. By supporting the evolution of semiconductors, we are enhancing society’s information processing capabilities and fundamentally changing the way people live and industries operate. This embodies the Resonac vision of “Change Society through the Power of Chemistry,” playing a role in connecting social issues with technological innovation.

Contributions to Society and the Environment Strengthen Our Businesses
In December 2025, we held our first “Suppliers’Day” with the aim of further strengthening our co-creation relationships with strategic suppliers. 153 people from 64 companies participated, sharing their business policies and sustainability initiatives. We also presented awards such as the “Partner of the Year” and “Sustainability Partner Award” to suppliers that have made significant contributions to our business. Through this initiative, we are promoting the establishment of a sustainable and resilient supply chain and further deepening our co-creation relationships with strategic suppliers.

Suppliers’Day(December 2025)
TOPICS 2026
The “US-JOINT” Consortium Officially Kicks Off: Opening Ceremony Report

Resonac’s Patent on Liquid Encapsulant for AI Semiconductor Packages Upheld
