Business Strategies - Front-end / Back-end Semiconductor Materials
Products line-up and Relationship with Daily Life
Mission of Front-end / Back-end Semiconductor Materials Business
Through our strengths, which include a wide range of products and co-creation with industry peers, we are able to quickly catch up with changes in the industry to create high-value-added products that meet customer needs.
This contributes to continuous business expansion, which drives Resonac’s growth into a world-class functional chemical company.
Strengths and Competitiveness for Realizing our Long-Term Vision
We will make use of Resonac’s strengths and competitive advantages to become a world-class functional chemical company and a company that can compete on the world stage by 2030.
- Because we have a lineup of products that cover a wide range of semiconductor processes from front-end to back-end and we own several products that command the top market share, we can anticipate growth exceeding the increase in the number of chips as the number of components used rises with the higher integration of semiconductors. (Average growth rate of AI semiconductors from 2024 to 2028: 31%/year)
- With the limit to density increases in front-end processes becoming apparent as semiconductor design processes become more sophisticated and complex, attention has been turning to moves aiming for higher integration through the evolution of back-end technologies. As our particular strengths lie in our ability to make proposals for back-end materials, we are able to flexibly respond to customer needs.
- Japan and the U.S. lead JOINT, a consortium of material, equipment, and substrate manufacturers aimed at establishing next-generation semiconductor packaging and evaluation technologies. We use our expansive network to quickly grasp changes and create high-value-added products that meet the needs of our customers
Customer Needs in AI Semiconductors
Resonac Semiconductor Materials are Becoming More Prevalent in AI Semiconductors
Compared to conventional semiconductors, AI semiconductors have a higher number of components and larger packages, which will lead to increased demand for semiconductor materials. We will continue to lead the semiconductor materials industry, as we have multiple products with top market share in both materials used in conventional semiconductors and AI semiconductors, as well as materials for AI semiconductors.
Strategies of Front-end / Back-end Semiconductor Materials Business for the Achievement of the Long-Term Vision
Co-Creative Development Strategy
We are leading JOINT consortium activities in Japan and the U.S. together with external semiconductor material manufacturers, equipment manufacturers, and substrate manufacturers. Furthermore, the Packaging Solution Center, which possesses semiconductor manufacturing equipment, can verify technology during the manufacturing process, and as such serves as a hub for co-creation. Resonac will promote the co-creative development of cutting-edge technologies in a bid to continue leading the semiconductor materials industry.
Accelerating New Product Development and Increasing Production Capacity for Advanced Semiconductor Packaging Materials
We are gradually increasing our production capacity for NCF insulating adhesive films and TIM heat dissipation sheets, which are attracting attention as materials for AI semiconductor packages, from 3.5x to 5x, with the aim of strengthening our stable supply capacity. We will continue to increase our production capacity in a timely manner to meet the rapidly expanding demand in the AI Semiconductor market in a bid to further strengthen our market advantage. Additionally, we will accelerate our development of new products for advanced semiconductor packages, aiming for contribution to improving semiconductor performance from the materials side.
Vision for 2030 and Roadmap to Achieve It
Front-end / Back-end Semiconductor Materials Business TOPICS 2025
Results of JOINT2 Activities
JOINT2 is a consortium aimed at developing next-generation semiconductor packaging technology joined by 14 Japanese companies. By promoting the mutual use of technology and information, we succeeded in creating a chip-embedded interposer* prototype with a view to increasing the size. This prototype uses 510 x 515 mm panels, with 20 bridge dies mounted on each panel, and insulating film and copper wiring were formed to demonstrate high-density wiring technology. We expect to commercialize this between 2027 and 2028, ahead of which we will work to enhance performance and establish mass production technology.
- * 510 x 515 mm panel chip-embedded interposer
US-JOINT: Building Relationships and Forums for Customers and Consortium Members to Chat Casually in the U.S.
US-JOINT is a consortium for joint research on next-generation semiconductors, and is scheduled to start operations during 2025. By working closely with hyperscalers and major semiconductor manufacturers based in Silicon Valley and elsewhere in the U.S., and through co-creation with the 12 participating material- and equipment-related companies, we will contribute to realizing the concept of next-generation semiconductor packages ahead of the rest of the world.
In recognition of the consortium’s efforts, Resonac received the Special Consortium Award at the 2025 3D InCites Technology Enablement Awards.
Awarded Outstanding Interactive Presentation Paper at the 74th ECTC
The Electronic Components and Technology Conference (ECTC) is the world’s largest international conference on semiconductor packaging and mounting technologies. The award ceremony was held at the ECTC 2025 event held in Dallas, U.S. in May.
The increasing size of AI semiconductor packages presents the challenge of controlling warpage while maintaining connection reliability. By optimizing the mechanical properties of our MCL products, we proposed and demonstrated a solution that can address the above issues, which was appreciated for the award.
