Business Strategies - Front-end / Back-end Semiconductor Materials

Products Line-up

“Structure-based” proposal capabilities realized through advanced semiconductor materials and evaluation foundations.  In addition to our broad lineup of products with high market share, we will leverage our World-Class packaging evaluation foundation to move toward material proposals “created proactively” starting from packaging structures

products line-up
  • Source: Fuji Chimera Research Institute “2024 Electronics Packaging New Materials Handbook,” Copper Clad Laminate for Package 2023 actual (value basis), Dry Film Resist 2023 actual (shipping value basis), Encapsulant 2023 actual (volume and value basis), Underfill for Primary Jisso 2023 actual (volume and value basis); Photosensitive insulation materials*, Buffer coating materials and rewiring materials 2023 actual (volume:* products of HD MicroSystems L.L.C., a group company) 
  • Source:Fuji Keizai “2025 Semiconductor Materials Market: Current Status and Future Outlook”: Die bonding film, 2024 actual results (volume); CMP slurry (for STI), 2024 actual results (value) 

 

Strength of This Business (Resonac Pride Products and Services)

Packaging and Power Solution Center (Shinkawasaki)

・Degree of contribution to the environment through improved semiconductor package performance
・JEvolution of co-creation at JOINT3
・Business creation capability

 

Packaging & Power Solution Center

Medium- to Long-Term Vision of Front-end / Back-end Semiconductor Materials

With an eye to realizing a society in which humans and AI co-create, as a leading semiconductor materials company that proposes solutions based on deep insight into chemistry and an understanding of semiconductor devices, we will contribute to accelerating the development of advanced devices that realize a sustainable society. 

Hiroyuki Yamashita

Vision for 2030 and Roadmap to Achieve It

Achievements to DateIssuesPriority Measures for Phase 2
  •  Promoted the expansion of materials and concentrated investments in strategic products for growth areas such as AI semiconductor packages and advanced logic and memory applications
  • Contributed to improvements in revenue and the EBITDA margin through portfolio strategies
  • Established US-JOINT and JOINT3 as frameworks for global co-creation activities with equipment and materials manufacturers, and accelerated the technological development of advanced semiconductor packages
  • Built a robust supply chain to respond to geopolitical risks in a bid to secure stable supply and strengthen our competitive edge
  • Enhancement of ability to respond to accelerating technological advancements
    Amid the spread of generative AI and the advancement of digital infrastructure, the speed of semiconductor technology evolution and the level of customer demands are increasing. Strengthening our technological and product development capabilities to continue to meet these demands is a challenge. 
  • Continuing to provide value for next-generation semiconductors
    To continuously provide value in the field of next-generation semiconductors, innovative evolution is required in all aspects of our products, supply, and business operations 
  • Advancement of supply chain management, which supports stable supply
    Amid rising geopolitical risks, demands for supply stability are mounting, making the advancement of management that oversees the entire supply chain a key issue to be addressed
  • Further deepen business operations centered on co-creation to strengthen competitiveness in the field of next-generation semiconductors
  • Enhance product capabilities by strengthening collaboration with partners through JOINT activities, while promoting contributions to energy conservation and reducing environmental impacts by improving material performance
  • In light of geopolitical risks, advance the sophistication of the supply chain management system centered on collaboration with suppliers, aiming to achieve both a stable supply and business growth
Plans for 2026
Priority Measures: Growth Strategy for Next-Generation Semiconductors Field
In 2026, we will further promote product portfolio reform and aim to expand high-value-added businesses centered on the next-generation semiconductors field. We will steadily advance the growth of strategic products for growth fields while leading to medium- to long-term business growth through the continuous market introduction of new products. US-JOINT and JOINT3 will fully start initiatives leading to the creation of new technological themes and product concepts through collaboration with partners. At the same time, we will work to foster a sense of unity at the business headquarters and develop human resources through global dialogues, as well as strengthen manufacturing capabilities utilizing SPC (Statistical Process Control). Furthermore, in advancing our supply chain management system, we will improve supply stability by strengthening our collaboration with strategic suppliers and promoting multi-sourcing, as well as improve our adjustment capabilities through the visualization of supply-demand data. Additionally, we will strengthen risk resilience by diversifying our bases and establishing alternative production systems. 

Semiconductor market driven by generative AI

The semiconductor market is expanding amid the spread of generative AI, with AI-related applications driving growth in particular. The market structure is undergoing a major shift from being traditionally non-AI-centric to being AI-driven.

Market

Changing Society: Specific Example

With the rapid expansion of generative AI, cloud computing, and data centers, society is calling for advanced information processing at an unprecedented speed. Semiconductors, which play a central role in this, not only require miniaturization and high-level integration, but also the tackling of complex challenges such as reducing power consumption, heat dissipation, and reliability. At Resonac, we have evolved our solution proposals starting from the packaging structures, leveraging our strengths in a range of materials covering front-end to back-end processes and our World- Class evaluation and analysis foundations. Through co-creation with semiconductor manufacturers, fabless companies, equipment manufacturers, and materials manufacturers, we are transforming development processes that were previously fragmented across individual companies, achieving a new development model that optimizes everything from semiconductor package design to evaluation in an integrated manner. This simultaneously enables high performance while reducing the power consumption of AI servers, contributing to improved energy efficiency across the entire digital infrastructure. By supporting the evolution of semiconductors, we are enhancing society’s information processing capabilities and fundamentally changing the way people live and industries operate. This embodies the Resonac vision of “Change Society through the Power of Chemistry,” playing a role in connecting social issues with technological innovation. 

Growth Oportunities

Contributions to Society and the Environment Strengthen Our Businesses

In December 2025, we held our first “Suppliers’Day” with the aim of further strengthening our co-creation relationships with strategic suppliers. 153 people from 64 companies participated, sharing their business policies and sustainability initiatives. We also presented awards such as the “Partner of the Year” and “Sustainability Partner Award” to suppliers that have made significant contributions to our business. Through this initiative, we are promoting the establishment of a sustainable and resilient supply chain and further deepening our co-creation relationships with strategic suppliers. 

Suppliers’Day
Suppliers’Day(December 2025)

TOPICS 2026

The “US-JOINT” Consortium Officially Kicks Off: Opening Ceremony Report

Resonac’s Patent on Liquid Encapsulant for AI Semiconductor Packages Upheld