Resonac group has global top level share materials for semiconductor.
Resonac is a function chemical company that integrated Showa Denko and Showa Denko Materials (formerly Hitachi Chemical) in January 2023.
Resonac has various materials line up for semiconductor front-end and back-end process, and keep high market share especially in back-end process.
Resonac assists production activities around the world with back-end process offering such as Die attach film, cupper clad laminates and encapsulating materials supported by superior functionality.
Quantity sales result(2021)※1：2,210,000m2
Die bonding films feature a hybrid composition of epoxy, acrylic rubber resin, and nano-filler (Resonac holds a composition-of-matter patent) that allows the films to be temporarily heat-compressed on a substrate. After thermosetting, the high adhesive strength of the epoxy components and the flexibility (stress relaxation) of the rubber components contribute to maintaining the stable adhesion and electric connection of packages even under severe temperature conditions.
Quantity sales result(2021)※1：6,900,000m2
Resonac Group’s products use unique, low CTE (coefficient of thermal expansion) resins for substrate materials to uniformly increase the filling amount of inorganic materials, thereby reducing warpage and enhancing hardness. These products also feature the diametric function of enabling easy hole drilling. In addition, our products offer excellent connection reliability and low transmission loss, and can contribute to the function of mass simultaneous computation.
Quantity sales result(2021)※1：19,400t
After acquiring part of Nitto Denko’s encapsulating materials business in 2012, we achieved the high-filling amount of inorganic materials and the high fluidity of encapsulants by combining Nitto Denko’s kneading technology and our compounding technology, contributing to higher formability and reliability. With foreign substance control becoming increasingly strict for automotive applications in recent years, we have developed a countermeasures line to provide high quality encapsulants.
Resonac Group’s Thermal interface material sheets feature thickness accuracy and flexibility (followability) superior to conventional materials, contributing to optimal thermal management.
Other firms’ products are horizontally oriented to dissipate heat, but Resonac Group’s products are vertically oriented, a unique feature increasing our presence in the market.
Resonac Group’s resin design technology is utilized to achieve excellent resolution, line-width stability, and high adhesion to substrates. Our products also help to efficiently pattern fine-pitch circuits in laser direct imaging. Being able to offer a lineup of thick films for various applications is an additional strength.
Resonac Group’s products provide low thermal expansion and low shrinkage to realize reduced warpage, facilitating the mounting of semiconductor package substrates.
Our products also offer excellent resolution, high reliability, and particularly, superior resistance to cracking.
With finer-pitch patterns in the front-end process reaching their limits in terms of technology and cost, companies around the world are focusing their efforts on technological innovations in the back-end process.
There is a limit to what one company can do to meet today’s rapidly accelerating pace of technological innovation. As a pioneer of the next cutting edge semiconductors, the Resonac Group has established an open innovation center to co-create with other firms with the aim of becoming a one-stop partner speedily providing highly reliable materials.
The Packaging Solution Center was established in 2018 in Kawasaki City, Japan, as a research and development hub for semiconductor back-end process technology. To create cutting-edge technologies for increasingly advanced, complex semiconductor packages, including memories, servers, autonomous vehicles, and other applications, the facility comprehensively assesses the back-end manufacturing process to enhance material functionality and offer greater value to our clients.
JOINT2 is a co-creation consortium consisting of 13 Japanese semiconductor materials, devices, and substrates manufacturers, including the Resonac Group. The consortium is collaborating on substrates, materials, and equipment to help resolve customer issues and accelerate development. Specially we are conducting collaborative evaluations with several leading semiconductors manufacturers on 2.xD/3D packages.
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