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2025.07.16
Business
Resonac Wins the 24th GSC Award's Minister of Economy, Trade and Industry Prize
~ High-Quality SiC Epitaxial Wafers for Power Semiconductors Recognized for Contribution to Carbon Neutrality ~ - 2025.07.08 R&D Resonac and Tohoku University Launch Joint Research on Technology to Produce SiC Power Semiconductor Materials from Waste Silicon and CO2
- 2025.07.04 Other Security Incident at Our Company (Fifth Report)
- 2025.07.01 Business Announcement Regarding the Sale of F2 Chemicals Ltd.
- 2025.06.27 Business Resonac and PulseForge Unite to Advance Photonic Debonding for Next-Gen Semiconductor Packaging
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2025.06.18
Management / IR
Crasus Chemical Inc. : Presentation Material (archived video is available on the “IR Webcasts” page)
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2025.05.15
Management / IR
Consolidated Financial Statements for the first quarter ended March 31, 2025
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2025.05.15
Management / IR
Consolidated Financial Results, First Quarter 2025: Presentation Material
- 2025.04.28 Management / IR Notice Regarding Early Repayment of Subordinated Loan
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2025.03.26
Management / IR
Consolidated Financial Statements for the fiscal year ended December 31, 2024 (Under IFRS)
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2025.07.16
Business
Resonac Wins the 24th GSC Award's Minister of Economy, Trade and Industry Prize
~ High-Quality SiC Epitaxial Wafers for Power Semiconductors Recognized for Contribution to Carbon Neutrality ~ - 2025.07.01 Business Announcement Regarding the Sale of F2 Chemicals Ltd.
- 2025.06.27 Business Resonac and PulseForge Unite to Advance Photonic Debonding for Next-Gen Semiconductor Packaging
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2025.02.12
Business
Resonac Develops Low Thermal Expansion Copper-Clad Laminates for Next-Generation Semiconductor Packages through Simulation
~Resonac introduces a unique in-house system to visualize design guidelines for each material~ - 2025.02.05 Business Resonac Transfers Exhaust Gas Abatement Equipment Business in Japan and Taiwan
- 2025.07.08 R&D Resonac and Tohoku University Launch Joint Research on Technology to Produce SiC Power Semiconductor Materials from Waste Silicon and CO2
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2025.06.19
R&D
Resonac Conducts Evaluation of Semiconductor Materials for Space Applications Aboard International Space Station
~ Aiming to Enhance the Performance of Space-Oriented Semiconductors ~ -
2025.06.13
R&D
Joint Research and Development on Glycine Production Utilizing Emitted CO2 by Resonac, Nippon Steel, Nippon Steel Engineering, and the University of Toyama Selected by NEDO
~ Aiming for direct production of glycine from methanol derived from CO2 emitted by steel plants etc. ~ - 2025.04.22 R&D Resonac Corporation and Yokohama National University Sign a Comprehensive Partnership Agreement
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2025.03.27
R&D
Resonac and Microwave Chemical Launch Full-Scale Development of Chemical Recycling Technology to Directly Convert Used Plastics into Basic Chemical Products
~Following selection as a GI Fund Project, Resonac and Microwave Chemical strengthen collaborative development framework~
- 2025.05.14 Sustainability Resonac Holdings Selected as “SX Brand 2025”
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2024.12.27
Sustainability
Resonac Holds Sustainability Meeting 2024
- CEO, CHRO, General Manager of Electronics Business Headquarters, CSuO, Outside Board Director Mr. Yasukawa, and CSO/CRO explain progress on reforms aimed at enhancing Resonac’s corporate value - -
2024.10.04
Sustainability
Ecosystem Conservation Activity Hub in Ibaraki Prefecture Recognized as a "Nature Coexistence Site" by the Ministry of the Environment
–Promoting biodiversity conservation activities in collaboration with NPOs and local communities to achieve the international "30by30" Goal – -
2024.09.11
Sustainability
Resonac Group Issues Integrated Report “RESONAC REPORT 2024”
̶Focusing on "Resonac's earning power"̶ -
2024.09.03
Sustainability
Resonac Group Participates in Nagano Prefecture's "Forest Foster Parent Promotion Project"
-Collaborating with the community to promote wide-ranging forest conservation activities including construction of walking trails and tree planting-
- 2025.07.04 Other Security Incident at Our Company (Fifth Report)
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2025.06.03
Other
Security Incident at Our Company (Fourth Report)
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2025.05.23
Other
Security Incident at Our Company (Third Report)
- 2025.05.21 Other Security Incident at Our Company (Second Report)
- 2025.05.20 Other Security Incident at Our Company (First Report)
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